Porous copper film materials, electromagnetic wave shielding materials, and manufacturing methods of porous copper film materials

TW202641989APending Publication Date: 2026-10-16SHIKOKU KASEI HLDG CORP +1
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Patent Information

Application Number
TW115110721
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-02
Filing Date
2026-03-20
Publication Date
2026-10-16

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Abstract

This invention provides a porous copper film that combines thinness with good electromagnetic wave shielding performance. The invention relates to a porous copper film material (1), comprising a substrate (20) and a porous copper film (10) formed on at least one side of the substrate (20). The porous copper film (10) has a thickness of 0.01–3.00 μm and a porosity of 10–50%.
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