Substrate processing methods, semiconductor device manufacturing methods, processes, and substrate processing apparatus

Abstract

This invention provides a technique for suppressing particle adhesion to a substrate. It comprises: (a) storing a processing gas in a storage section; (b) controlling the pressure in a second section connected to a carrier gas supply source and a first section to a predetermined pressure; (c) supplying the processing gas to the substrate, the step including (c1) supplying the processing gas stored in the storage section to the substrate via the first section; and (d) supplying the carrier gas to the substrate via the first section and the second section after (b) and beginning during (c), such that the pressure in the storage section at the start time of (d) is above the predetermined pressure.

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