Catalyst solution for electroless copper plating
TW202642011APending Publication Date: 2026-10-16ORCHEM
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115113266
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-03
- Filing Date
- 2026-04-02
- Publication Date
- 2026-10-16
Smart Images
Figure 00000000_0000_ABST
Abstract
This application relates to a catalyst solution for electroless copper plating. The catalyst solution of this application incorporates an antioxidant, exhibiting excellent catalytic performance even with a medium concentration of palladium in the bath preparation ratio. Furthermore, the original solution remains unchanged over time, ensuring the longevity of the bath preparation solution and the reliability of the plating process when applied on-site. none
Need to check novelty before this filing date? Find Prior Art