Metal sheet, laminate, insulating circuit board, and manufacturing method of metal sheet

TW202642015APending Publication Date: 2026-10-16MITSUBISHI MATERIALS CORP
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Patent Information

Application Number
TW115108706
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-03-05
Filing Date
2026-03-10
Publication Date
2026-10-16

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    Figure TWG2TA001081194_003
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Abstract

The metal sheet having a plate body (31) and a surface treatment layer (35) formed on the outermost layer of the plate body, wherein the non-uniformity rate defined as the ratio of the total area of ​​the detected area to the total area of ​​the field of view of 128μm×128μm obtained by laser microscopy with the lower limit Threshold set to 125 and the detection lower limit area set to 300pixel2 is less than 5.5%, and the unfolded interface area ratio Sdr of the surface of the aforementioned surface treatment layer is set to be in the range of 50% to 65%.
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