Conveying system and diffusion furnace

TW202642025APending Publication Date: 2026-10-16BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
TW114147638
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-12-05
Publication Date
2026-10-16

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    Figure TWG2TA001080661_001
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    Figure TWG2TA001080661_002
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    Figure TWG2TA001080661_003
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Abstract

This application discloses a conveying system and a diffusion furnace, belonging to the field of semiconductor processing technology. In the conveying system, an inlet assembly extends axially along the process chamber of the diffusion furnace and communicates with the process chamber; in the inlet assembly, a second inlet pipe is sleeved outside the first inlet pipe, and a conveying gap is formed between the second inlet pipe and the first inlet pipe; the outlet ends of the first and second inlet pipes are both close to the furnace door of the diffusion furnace; one end of the first input pipe is connected to the process gas source, and the other end is connected to the inlet end of the first inlet pipe; the inlet end of the second inlet pipe is located on the side wall of the second inlet pipe and away from the furnace door. One end of the second input pipe is connected to a water source, and the other end is connected to the inlet end of the second inlet pipe.
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