Fiber bundling agents, fiber bundles, molding materials and molded articles

TW202642034APending Publication Date: 2026-10-16DIC CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114147870
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-24
Filing Date
2025-12-08
Publication Date
2026-10-16
Patent Text Reader

Abstract

The present invention aims to provide a fiber bridging agent that exhibits excellent storage stability and bridging properties, generates minimal thermal decomposition gases during molding, and contributes to the resistance of molded articles to yellowing. The solution of the present invention utilizes a fiber bridging agent comprising an aqueous urethane resin composition containing an urethane resin and an aqueous medium. The urethane resin is characterized by using a polyol compound, a diisocyanate compound, a compound containing a nonionic group, and a hydrazine derivative having an active hydrogen atom as essential raw materials. The polyol compound comprises a polyester polyol; the diisocyanate compound comprises an aliphatic diisocyanate compound and / or an alicyclic diisocyanate compound; the compound containing the nonionic group comprises polyoxyethylene monomethyl ether and / or polyethylene glycol; and the content of the compound containing the nonionic group in the raw materials of the urethane resin is in the range of 3-10% by mass.
Need to check novelty before this filing date? Find Prior Art