Surface shape measurement methods and surface shape measurement systems
TW202642142APending Publication Date: 2026-10-16MITSUBISHI HEAVY IND LTD
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Patent Information
- Application Number
- TW115102531
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-21
- Filing Date
- 2026-01-22
- Publication Date
- 2026-10-16
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Abstract
To provide a surface shape measurement method, when the measurement object is any machine from a storage section of stored raw material to a utilization section where the raw material is pulverized into powder via a pulverizer, the surface shape can be measured in a low-cost and convenient manner. The surface shape measurement method, which measures the shape of the surface in contact with the raw material and / or the powder via any machine from a storage section of stored raw material to a utilization section where the powder is pulverized, includes the steps of: attaching the powder to the surface of the measurement object; and irradiating the measurement object with light to perform optical three-dimensional measurement.
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