Preprocessing method for wafer defect detection and related products

Abstract

The present invention provides a preprocessing method for wafer defect detection and related products. The preprocessing method for wafer defect detection includes: acquiring a metal layer layout of a wafer to be detected; expanding the outer contour of a layout pattern of the metal layer layout, and acquiring an expanded contour map expanded to the outer perimeter of the layout pattern; dividing the expanded contour map to obtain multiple types of rectangular units; clustering and grouping at least one type of rectangular units within their respective categories according to the geometric characteristics of the rectangular units; and inputting the rectangular units that have not been clustered and grouped within their respective categories, as well as a grouping result of the clustered and grouped rectangular units, into a database utilized by a die-to-database defect detection technology. The preprocessing method for wafer defect detection and related products of the present invention enhance the detection accuracy of wafer defect detection.

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