Thin-film probe card structure

Abstract

This invention relates to the field of wafer testing, specifically to a thin-film probe card structure. The thin-film probe card structure includes a connector, a flexible thin film, a fixing member, a conductive member, a conductive layer, and multiple probes. The side of the flexible thin film is attached to the bottom surface of the connector via the fixing member. The conductive layer is disposed on the top surface of the flexible thin film. The conductive member is mounted on the connector and located above the side of the flexible thin film. The side of the conductive layer is located between the conductive member and the flexible thin film, and there is no gap between the side of the conductive layer and the conductive member, resulting in a conductive connection. Multiple probes are spaced apart and mounted on the bottom surface of the flexible thin film in the middle, and the probes are conductively connected to the conductive layer. Because the conductive layer and the conductive member are conductively connected through a gapless contact, there are no solder joints between them. Therefore, the electrical signal is not subject to transient impedance changes caused by solder joints during transmission, effectively preventing signal reflection and leakage.

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