Test interface structure and chip test equipment

Abstract

This invention relates to the field of wafer testing technology, specifically to a test interface structure and wafer testing equipment. The test interface structure includes: a substrate, which is disposed above a wafer carrier platform and mounted on the bottom of a light source provider; the substrate has multiple spaced-apart and through-holes, each hole having a light-transmitting partition structure configured to form a first partition space with a dry environment between itself and the light source provider, and further configured to form a second partition space between itself and the wafer carrier platform allowing the introduction of dry gas or vacuuming; and multiple objective lenses, each objective lens being correspondingly mounted in one of the multiple holes, and the objective lenses being located above the bottom surface of the partition structure. Using the test interface structure of this invention, the objective lenses provide a clear field of view and facilitate testing.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and more specifically to test interface structures and wafer testing equipment. Prior Technology

[0002] Based on testing requirements, wafer testing equipment needs to perform signal testing on wafers in high temperature, normal temperature and low temperature environments.

[0003] The light source provider generates a lot of heat during long-term operation, which causes the temperature of the light source provider and objective lens of the test probe card to be high. Therefore, when performing low-temperature testing, the temperature of the objective lens of the test probe card will be higher than the temperature of the environment where the wafer under test is located. However, if the humidity of the environment where the wafer under test is located is slightly high, condensation or frost may form on the objective lens of the test probe card, making the objective lens of the test probe card blurry and difficult to test.

[0004] Furthermore, after a wafer has been tested in a high-temperature environment, if it is to be tested in a lower-temperature environment, such as from high temperature to room temperature, from high temperature to low temperature, or from room temperature to low temperature, the objective lens temperature will be higher than the ambient temperature of the wafer under test. This can cause condensation or frost to form on the objective lens, making the objective lens of the test probe card blurry and difficult to test. Therefore, after testing at a higher ambient temperature, the same wafer testing equipment cannot be used for the next test at a lower ambient temperature. In this case, a test probe card specifically designed for low-temperature testing must be used. Summary of the Invention

[0005] The purpose of this invention is to solve the following technical problems: when conducting low-temperature tests, condensation or frost may form on the objective lens, making the objective lens blurry and difficult to conduct the test; and when conducting the next test in a lower-temperature environment after completing the test in a higher-temperature environment, condensation or frost may form on the objective lens, making the objective lens blurry and difficult to conduct the test.

[0006] To achieve the above objectives, the present invention provides a test interface structure comprising: a substrate for being disposed above a wafer carrier platform and for being mounted on the bottom of a light source provider; the substrate having a plurality of spaced and through-holes, each hole having a light-transmitting partition structure configured to form a first partition space with a dry environment between itself and the light source provider, and further configured to form a second partition space between itself and the wafer carrier platform that allows for the filling of dry gas or the evacuation of a vacuum; and a plurality of objective lenses, each objective lens being mounted in one of the plurality of holes, and the objective lenses being located above the bottom surface of the partition structure.

[0007] In some embodiments, the first partition space is configured to allow its dry environment to be maintained by continuously filling it with dry gas.

[0008] In some embodiments, the partition structure includes a first light-transmitting plate, the outer periphery of which is sealed to the wall of the opening.

[0009] In some embodiments, the first light-transmitting plate is a glass plate or a filter plate.

[0010] In some embodiments, the first light-transmitting plate is located at the middle or bottom of the opening.

[0011] In some embodiments, the test interface structure further includes a second light-transmitting plate sealed and mounted on the opening, and a first partition space with a dry environment is formed between the second light-transmitting plate and the first light-transmitting plate, wherein the dry environment is formed by filling with dry gas or by vacuuming.

[0012] In some embodiments, the test interface structure further includes a second light-transmitting plate that is sealed and installed on the opening, forming a sealed space between the second light-transmitting plate and the first light-transmitting plate, the sealed space being filled with dry gas or in a vacuum state.

[0013] In some embodiments, the second light-transmitting plate is located at the middle or top of the opening, and the distance between the second light-transmitting plate and the top of the opening is less than the distance between the first light-transmitting plate and the top of the opening.

[0014] In some embodiments, the objective lens is located between the second light-transmitting plate and the first light-transmitting plate.

[0015] In some embodiments, the objective lens is located between the second light-transmitting plate and the top of the opening.

[0016] In some embodiments, the second light-transmitting plate is a glass plate or a filter plate.

[0017] In some embodiments, the diameter of the opening gradually decreases from top to bottom.

[0018] The present invention also provides a wafer testing device, which includes a light source provider, a wafer carrier platform and the aforementioned test interface structure. A substrate is mounted on the bottom of the light source provider, and an objective lens is capable of focusing the light provided by the light source provider. The light source provider and the test interface structure are located above the wafer carrier platform, which is capable of supporting and fixing the wafer under test.

[0019] The above-mentioned technical solution of the present invention has the following beneficial effects:

[0020] When conducting low-temperature tests, or when performing a test in a lower temperature environment after completing a test in a higher temperature environment, the second partition space can be filled with dry gas or evacuated to maintain a dry environment. This prevents moisture in the air from adhering to the bottom surface of the partition structure and causing condensation or frost, ensuring a clear objective lens field of view and facilitating testing. Simultaneously, the dry environment of the first partition space also enhances the isolation and protection of the objective lens, further preventing condensation or frost formation on the objective lens and partition structure due to temperature drops. This ensures a clear objective lens field of view and facilitates testing, and eliminates the need to replace the test probe card specifically designed for low-temperature testing. Therefore, the test interface structure of this invention enables a clear objective lens field of view and facilitates testing. Simple Explanation of the Diagram

[0021] Figure 1 is a schematic diagram of the test interface structure in one embodiment of the present invention; Figure 2 is a schematic diagram of a wafer testing device according to an embodiment of the present invention; Figure 3 is a schematic diagram of the test interface structure in another embodiment of the present invention; Figure 4 is a schematic diagram of the test interface structure in another embodiment of the present invention; Figure 5 is a schematic diagram of the test interface structure in another embodiment of the present invention; Figure 6 is a schematic diagram of the test interface structure in another embodiment of the present invention; Figure 7 is a schematic diagram of the test interface structure in another embodiment of the present invention. Implementation

[0022] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended only to explain the present invention and not to limit the present invention. For those skilled in the art, the present invention can be practiced without some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present invention by illustrating examples of the invention.

[0023] Typically, in this field, the high-temperature, room-temperature, and low-temperature environments of the wafer under test (DUT) are provided by the wafer carrier platform 5. The wafer carrier platform 5 is internally equipped with a temperature regulation device, enabling it to heat, cool, or maintain a room temperature, thus placing the DUT in a high-temperature, room-temperature, or low-temperature environment. When the DUT is in a low-temperature environment, the surrounding environment will also be at a low temperature. The light source provider 4 generates a large amount of heat during prolonged operation, which is conducted to the objective lens, raising its temperature. This results in the objective lens temperature being higher than the ambient temperature of the DUT. Therefore, if the humidity of the DUT's environment is slightly high, condensation or frost may form on the objective lens, causing it to become blurry and difficult to test. Furthermore, when the DUT is tested in a higher-temperature environment and then needs to be tested in a lower-temperature environment, such as from high temperature to room temperature, from high temperature to low temperature, or from room temperature to low temperature, the objective lens temperature will again be higher than the ambient temperature of the DUT, potentially causing condensation or frost on the objective lens, blurring the objective lens of the test probe card and making testing difficult. Therefore, after completing the test in a higher temperature environment, the same chip testing equipment cannot perform the next test in a lower temperature environment. At this time, it is necessary to replace it with a test probe card specifically designed for low temperature testing.

[0024] As shown in Figures 1 and 2, the present invention provides a test interface structure, which includes a substrate 1 and multiple objective lenses 3. The substrate 1 is disposed above a wafer support platform 5 and mounted on the bottom of a light source provider 4. The substrate 1 has multiple spaced-apart and through-holes 11, each with a light-transmitting partition structure 2. The partition structure 2 is configured to form a first partition space 12 with a dry environment between itself and the light source provider 4, and further configured to form a second partition space 13 between itself and the wafer support platform 5, allowing for the filling of dry gas or evacuation. The multiple objective lenses 3 are mounted one-to-one in the multiple openings 11, and the objective lenses 3 are located above the bottom surface of the partition structure 2.

[0025] Specifically, the substrate 1 has multiple spaced and through-holes 11, and each hole 11 has a partition structure 2 that allows light to pass through. After the substrate 1 is mounted on the bottom of the light source provider 4, the substrate 1 and the partition structure 2 can separate the space between the light source provider 4 and the wafer carrier platform 5. Specifically, a first partition space 12 can be formed between the partition structure 2 and the light source provider 4, i.e., the first partition space 12 is close to the light source provider 4; a second partition space 13 can be formed between the partition structure 2 and the wafer carrier platform 5, i.e., the second partition space 13 is close to the wafer carrier platform 5 and the wafer under test 6; and the partition structure 2 separates the first partition space 12 and the second partition space 13 to prevent gas convection from occurring in the first partition space 12 and the second partition space 13. Objective lens 3 is installed in opening 11 and is located above the bottom surface of partition structure 2. Therefore, partition structure 2 also separates objective lens 3 from the second partition space 13. The second partition space 13 can be filled with dry gas or evacuated to create a dry environment with low thermal conductivity, reducing water vapor condensation and preventing heat conduction. This prevents condensation or frost from forming on partition structure 2 due to temperature drop, ensuring a clear field of view for objective lens 3. Furthermore, objective lens 3 can be located in or above the first partition space 12. The first partition space 12 has a dry environment with low thermal conductivity, which also reduces water vapor condensation and prevents heat conduction. Therefore, the first partition space 12 can also enhance the isolation and protection effect for objective lens 3, further preventing condensation or frost from forming on objective lens 3 and partition structure 2 due to temperature drop in the first and second partition spaces 12, ensuring a clear field of view for objective lens 3.

[0026] Therefore, in this embodiment, when performing low-temperature testing, or when performing the next test in a lower-temperature environment after completing a test in a higher-temperature environment, the second partition space 13 can be filled with dry gas or evacuated to maintain a dry environment in the second partition space 13. This prevents moisture in the air from adhering to the bottom surface of the partition structure 2 and causing condensation or frost, ensuring a clear field of view for the objective lens 3 and facilitating testing. Simultaneously, the dry environment of the first partition space 12 also enhances the isolation and protection effect for the objective lens 3, further preventing condensation or frost from forming on the objective lens 3 and the partition structure 2 due to temperature drops. This ensures a clear field of view for the objective lens 3 and facilitates testing, and eliminates the need to replace the test probe card specifically designed for low-temperature testing. Therefore, the test interface structure of this invention enables a clear field of view for the objective lens 3 and facilitates testing.

[0027] In some embodiments, when a dry environment is formed by filling with a dry gas, the dry gas may be an inert gas or nitrogen, or a combination of the two gases in any suitable ratio.

[0028] In some embodiments of the invention, the first partition space 12 is configured to allow its dry environment to be maintained by continuously filling it with dry gas.

[0029] Specifically, during low-temperature testing, or after completing a test in a higher-temperature environment and then conducting the next test in a lower-temperature environment, dry gas can be continuously introduced into the first partition space 12 to create a positive pressure environment. This allows the air containing moisture in the first partition space 12 to be continuously expelled, maintaining a dry environment in the first partition space 12. Simultaneously, if there is fog on one side of the objective lens 3 in the first partition space 12, the fog will be dried by the continuous introduction of dry air.

[0030] As shown in Figures 1 to 7, in some embodiments of the present invention, the partition structure 2 includes a first light-transmitting plate 21, the outer periphery of which is sealed to the wall of the opening 11.

[0031] Specifically, the first partition space 12 is located between the first light-transmitting plate 21 and the light source provider 4, the second partition space 13 is located between the first light-transmitting plate 21 and the wafer carrier platform 5, and the objective lens 3 is positioned above the bottom surface of the first light-transmitting plate 21.

[0032] In some embodiments, the first light-transmitting plate 21 may be one or more. In some embodiments, when there is one or more first light-transmitting plates 21, adjacent first light-transmitting plates 21 may be attached to each other or spaced apart.

[0033] In some embodiments of the present invention, the first light-transmitting plate 21 is a glass plate or a filter plate.

[0034] Specifically, the glass plate has good light transmission, which does not affect the light intensity or the light path, thus ensuring signal accuracy. The filter plate, on the other hand, can filter out stray light, improve the light signal intensity, and adjust the light color and spectrum, thereby ensuring signal accuracy. Of course, the first light-transmitting plate 21 can also be made of other light-transmitting components that can achieve the above-mentioned technical effects; this invention does not impose any limitations.

[0035] In some embodiments, to further improve the light transmission effect, the first light-transmitting plate 21 may be a light-transmitting plate with a uniform thickness.

[0036] In some other embodiments, the first light-transmitting plate 21 may also be a light-transmitting plate with at least one of its top and bottom surfaces recessed; or, the first light-transmitting plate 21 may also be a light-transmitting plate with at least one of its top and bottom surfaces protruding; or, the first light-transmitting plate 21 may also be a light-transmitting plate with one of its top and bottom surfaces recessed and the other protruding outward.

[0037] In some embodiments of the present invention, at least a portion of the partition structure 2 is located at the center of the opening 11. For example, in some embodiments, a portion of the partition structure 2 is located at the center of the opening 11, while another portion is located at the bottom end of the opening 11. Yet another example, in some embodiments, the entire partition structure 2 is located at the center of the opening 11.

[0038] As shown in Figures 1 to 7, in some embodiments of the present invention, the first light-transmitting plate 21 is located at the middle or bottom of the opening 11.

[0039] Specifically, the first light-transmitting plate 21 is considered to be located at the center of the opening 11 as long as at least a portion of the first light-transmitting plate 21 is located at the center of the opening 11. In some embodiments, the distance between the center of the opening 11 and its bottom end is greater than the thickness of the first light-transmitting plate 21.

[0040] As shown in Figures 4 and 5, in some embodiments of the present invention, the test interface structure further includes a second light-transmitting plate 15 sealed and installed in the opening 11, and a first partition space 12 with a dry environment is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21, wherein the dry environment is formed by filling with dry gas or by vacuuming.

[0041] Specifically, the second light-transmitting plate 15 and the first light-transmitting plate 21 cooperate to form a first partition space 12, and this first partition space 12 is a relatively closed space, which can further improve the isolation and protection effect on the objective lens 3. In some embodiments, the space between the second light-transmitting plate 15 and the light source provider 4 can still be filled with dry gas or vacuumed to form a dry environment, further reducing water vapor condensation and preventing heat conduction.

[0042] As shown in Figures 6 and 7, in some embodiments of the present invention, the test interface structure further includes a second light-transmitting plate 15 sealed and installed in the opening 11. A sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21. The sealed space 14 is filled with dry gas or is in a vacuum state, so that the first partition space 12, the sealed space 14, and the second partition space 13 are all in a dry state.

[0043] Specifically, the first partition space 12 is formed between the first light-transmitting plate 21 and the light source provider 4, while a sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21. Therefore, the sealed space 14 is part of the first partition space 12. Furthermore, the sealed space 14 can further enhance the isolation and protection effect on the objective lens 3. The portion of the first partition space 12 excluding the sealed space 14 is defined as the external space. The external space and the sealed space 14 can be dried using the same or different methods. For example, both the external space and the sealed space 14 can be dried by filling them with drying gas. Alternatively, the external space can be dried by filling it with drying gas, while the sealed space 14 can be dried by vacuuming.

[0044] As shown in Figures 4 to 7, in some embodiments of the present invention, the second light-transmitting plate 15 is located at the middle or top of the opening 11, and the distance between the second light-transmitting plate 15 and the top of the opening 11 is less than the distance between the first light-transmitting plate 21 and the top of the opening 11.

[0045] Specifically, the second light-transmitting plate 15 is located above the first light-transmitting plate 21, and the two are spaced apart to form a first partition space 12 or a sealed space 14 between them.

[0046] As shown in Figures 4 and 6, in some embodiments of the present invention, the objective lens 3 is located between the second light-transmitting plate 15 and the first light-transmitting plate 21.

[0047] Specifically, the second light-transmitting plate 15 can be located at the top of the opening 11, and the first light-transmitting plate 21 can be located at the middle of the opening 11, so that a first separating space 12 or a sealed space 14 is formed between the second light-transmitting plate 15 and the first light-transmitting plate 21, extending from the middle of the opening 11 to the top of the opening 11. Furthermore, the objective lens 3 can be closer to the first light-transmitting plate 21. This first separating space 12 or sealed space 14 can be filled with dry gas or evacuated to create a dry environment, thereby placing the objective lens 3 in a dry environment and ensuring a clear field of view for the objective lens 3. Similarly, the space between the second light-transmitting plate 15 and the light source provider 4 can also be filled with dry gas or evacuated to create a dry environment, reducing water vapor condensation and preventing heat conduction.

[0048] As shown in Figures 5 and 7, in some embodiments of the present invention, the objective lens 3 is located between the second light-transmitting plate 15 and the top of the opening 11.

[0049] Specifically, both the first light-transmitting plate 21 and the second light-transmitting plate 15 are located in the middle of the opening 11, with the second light-transmitting plate 15 positioned above the first light-transmitting plate 21 and spaced apart. A first partition space 12 or a sealed space 14 is formed between the first light-transmitting plate 21 and the second light-transmitting plate 15. This first partition space 12 or sealed space 14 can be filled with dry gas or evacuated to create a dry environment. The objective lens 3 is located above the second light-transmitting plate 15; and relative to the top of the opening 11, the objective lens 3 can be closer to the second light-transmitting plate 15. Furthermore, the space between the second light-transmitting plate 15 and the light source provider 4 can also be filled with dry gas or evacuated to create a dry environment, reducing water vapor condensation and preventing heat conduction.

[0050] In some embodiments of the present invention, the second light-transmitting plate 15 is a glass plate or a filter plate.

[0051] Specifically, the glass plate has good light transmission, neither affecting the light intensity nor the light path, thus ensuring signal accuracy. The filter plate, on the other hand, filters out stray light and improves light brightness, thereby ensuring signal accuracy. Of course, the second light-transmitting plate 15 can also be made of other light-transmitting components that can achieve the above-mentioned technical effects; this invention does not impose any limitations.

[0052] In some embodiments, to further improve the light transmission effect, the second light-transmitting plate 15 may be a light-transmitting plate with a uniform thickness.

[0053] In some other embodiments, the second light-transmitting plate 15 may also be a light-transmitting plate with at least one of its top and bottom surfaces recessed; or, the second light-transmitting plate 15 may also be a light-transmitting plate with at least one of its top and bottom surfaces protruding; or, the second light-transmitting plate 15 may also be a light-transmitting plate with one of its top and bottom surfaces recessed and the other protruding outward.

[0054] In some embodiments of the present invention, the diameter of the opening 11 gradually decreases from top to bottom. On the one hand, this facilitates the mounting of the objective lens 3 from the top of the opening 11; on the other hand, it reduces the capacity of the opening 11, making it easier to quickly fill the opening 11 with dry gas or evacuate it.

[0055] In other embodiments, the opening 11 may also be a cylindrical hole, a hole with a diameter that gradually increases from top to bottom, or a polygonal hole, etc., and the present invention does not limit it.

[0056] In some embodiments of the present invention, a plurality of probes 16 are also provided at the bottom of the substrate 1.

[0057] The present invention also provides a wafer testing device, which includes a light source provider 4, a wafer support platform 5 and a test interface structure as described in the above embodiment. The substrate 1 is mounted on the bottom of the light source provider 4, and the objective lens 3 is capable of focusing the light provided by the light source provider 4. The light source provider 4 and the test interface structure are located above the wafer support platform 5, and the wafer support platform 5 is capable of supporting and fixing the wafer 6 to be tested.

[0058] Specifically, a first separating space 12 is formed between the separating structure 2 and the light source provider 4, and a second separating space 13 is formed between the separating structure 2 and the wafer carrier platform 5. The separating structure 2 isolates the first separating space 12 and the second separating space 13 to prevent gas convection in the first separating space 12 and the second separating space 13. The second separating space 13 can be filled with dry gas or evacuated to prevent condensation or frost from forming on the separating structure 2 due to temperature drop, thus ensuring a clear field of view for the objective lens 3. The objective lens 3 can be located in or above the first separating space 12. The dry environment of the first separating space 12 enhances the isolation and protection effect for the objective lens 3, further preventing condensation or frost from forming on the objective lens 3 and the separating structure 2 due to temperature drop in the first separating space 12 and the second separating space 13, thus ensuring a clear field of view for the objective lens 3.

[0059] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only for the purpose of helping to understand the method and core ideas of the present invention. The above are only preferred embodiments of the present invention. It should be noted that due to the limitations of textual expression, while there are objectively infinite specific structures, those skilled in the art can make several improvements, modifications, or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes, or combinations, or the direct application of the concept and technical solution of the present invention to other occasions without modification, should all be considered within the scope of protection of the present invention.

[0060] 1:Substrate 2: Separation Structure 3: Objective lens 4: Light source provider 5: Chip carrier platform 6: Chip under test 11: Opening 12: First dividing space 13: Second Dividing Space 14: Sealed space 15: Second light-transmitting panel 16: Probe 21: First light-transmitting panel

Claims

1. A test interface structure, characterized in that it includes: A substrate (1) is disposed above a wafer support platform (5) and mounted on the bottom of a light source provider (4); the substrate (1) has a plurality of spaced and through openings (11), each opening (11) having a light-transmitting partition structure (2), the partition structure (2) being configured to form a first partition space (12) with a dry environment between itself and the light source provider (4), and the partition structure (2) being configured to form a second partition space (13) between itself and the wafer support platform (5) allowing the filling of dry gas or the evacuation; and a plurality of objective lenses (3), each objective lens (3) being mounted in one of the plurality of openings (11), and the objective lenses (3) being located above the bottom surface of the partition structure (2); wherein the partition structure (2) separates the first partition space (12) and the second partition space (13) to prevent gas convection in the first partition space (12) and the second partition space (13).

2. The test interface structure as described in request item 1, wherein, The first partition space (12) is configured to allow its dry environment to be maintained by continuously filling it with dry gas.

3. The test interface structure as described in request item 1, wherein, The partition structure (2) includes a first light-transmitting plate (21), the outer periphery of which is sealed to the wall of the opening (11).

4. The test interface structure as described in request item 3, wherein, The first light-transmitting plate (21) is a glass plate or a filter plate.

5. The test interface structure as described in request item 3, wherein, The first light-transmitting plate (21) is located at the middle or bottom of the opening (11).

6. The test interface structure as described in request item 5, wherein, The test interface structure also includes a second light-transmitting plate (15) sealed and installed in the opening (11), and a first partition space (12) with a dry environment is formed between the second light-transmitting plate (15) and the first light-transmitting plate (21), wherein the dry environment is formed by filling with dry gas or by vacuuming.

7. The test interface structure as described in request item 5, wherein, The test interface structure also includes a second light-transmitting plate (15) sealed and installed in the opening (11), and a sealed space (14) is formed between the second light-transmitting plate (15) and the first light-transmitting plate (21), and the sealed space (14) is filled with dry gas or is in a vacuum state.

8. The test interface structure as described in request item 6 or 7, wherein, The second light-transmitting plate (15) is located at the middle or top of the opening (11), and the distance between the second light-transmitting plate (15) and the top of the opening (11) is less than the distance between the first light-transmitting plate (21) and the top of the opening (11).

9. The test interface structure as described in request item 8, wherein, The objective lens (3) is located between the second light-transmitting plate (15) and the first light-transmitting plate (21).

10. The test interface structure as described in request item 6 or 7, wherein, The objective lens (3) is located between the second light-transmitting plate (15) and the top of the opening (11).

11. The test interface structure as described in request item 6, wherein, The second light-transmitting plate (15) is a glass plate or a filter plate.

12. The test interface structure as described in any one of requests 1-7, wherein, The diameter of the opening (11) gradually decreases from top to bottom.

13. A wafer testing device, characterized in that it includes a light source provider (4), a wafer support platform (5), and a test interface structure as described in any one of claims 1-12, wherein the substrate (1) is mounted on the bottom of the light source provider (4), the objective lens (3) is capable of focusing the light provided by the light source provider (4), the light source provider (4) and the test interface structure are located above the wafer support platform (5), and the wafer support platform (5) is capable of supporting and fixing the wafer (6) to be tested.

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