Chuck for die level testing

TW202642179APending Publication Date: 2026-10-16SEMICS INC
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Patent Information

Application Number
TW114147072
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-23
Filing Date
2025-12-02
Publication Date
2026-10-16

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Abstract

A chuck for grain level testing includes: a movable chuck that supports multiple grains, and a chuck base disposed below the movable chuck and capable of supporting the movable chuck, wherein multiple vacuum adsorption holes can be formed on the upper surface of the movable chuck for adsorbing the grains. none
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