Chuck for die level testing

TW202642180APending Publication Date: 2026-10-16SEMICS INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114150178
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-08-05
Filing Date
2025-12-19
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001080757_001
    Figure TWG2TA001080757_001
  • Figure TWG2TA001080757_002
    Figure TWG2TA001080757_002
  • Figure TWG2TA001080757_003
    Figure TWG2TA001080757_003
Patent Text Reader

Abstract

A chuck for grain level testing may include: a plate having a plurality of vacuum adsorption holes defined on its upper surface to support a plurality of grains, and an alignment pattern, which is observed in a plane and is disposed adjacent to the plurality of vacuum adsorption holes.
Need to check novelty before this filing date? Find Prior Art