Apparatus for die level testing including mobile chuck with check pad

TW202642182APending Publication Date: 2026-10-16SEMICS INC
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Patent Information

Application Number
TW114151572
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-14
Filing Date
2025-12-29
Publication Date
2026-10-16

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Abstract

This invention discloses a grain-level testing apparatus including a movable chuck with a check valve. According to one aspect of the invention, the grain-level testing apparatus may include: a movable chuck having a mounting surface for placing grains and a plurality of vacuum suction holes for adsorbing the grains onto the mounting surface; a chuck base disposed below the movable chuck to support it; a chuck handle supporting the load of the movable chuck to enable its movement; a vacuum forming unit connected to the vacuum suction holes to form a vacuum pressure; and a controller controlling the operation of the vacuum forming unit.
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