Apparatus for die level testing including mobile chuck with check pad
TW202642182APending Publication Date: 2026-10-16SEMICS INC
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Patent Information
- Application Number
- TW114151572
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-07-14
- Filing Date
- 2025-12-29
- Publication Date
- 2026-10-16
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Abstract
This invention discloses a grain-level testing apparatus including a movable chuck with a check valve. According to one aspect of the invention, the grain-level testing apparatus may include: a movable chuck having a mounting surface for placing grains and a plurality of vacuum suction holes for adsorbing the grains onto the mounting surface; a chuck base disposed below the movable chuck to support it; a chuck handle supporting the load of the movable chuck to enable its movement; a vacuum forming unit connected to the vacuum suction holes to form a vacuum pressure; and a controller controlling the operation of the vacuum forming unit.
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