Wafer-level lens, lens unit, and optoelectronic module

TW202642199APending Publication Date: 2026-10-16RAYPRUS TECHNOLOGIES LTD
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Patent Information

Application Number
TW114113654
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-09
Filing Date
2025-04-10
Publication Date
2026-10-16

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Abstract

Embodiments of the present disclosure relate to the field of optical imaging technology, and specifically to a wafer-level lens, a lens unit, and an optoelectronic module. The wafer-level lens includes a wafer-level substrate, a plurality of lenses, and a plurality of support structures. The lenses are located on the wafer-level substrate. The support structures are located on the wafer-level substrate. Each support structure corresponds to one lens, and a projection of each support structure on the wafer-level substrate at least partially overlaps with the corresponding lens on the wafer-level substrate, to compensate for a tilt angle of an optical axis of the corresponding lens. The wafer-level lens is beneficial for improving the production efficiency and yield of optoelectronic modules.
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