Optical semiconductor package and manufacturing method thereof

Abstract

The present disclosure relates to an optical semiconductor package. The optical semiconductor package includes: a substrate; a plurality of conductive structures disposed in a first region on the substrate; a connecting structure disposed in a second region on the substrate; a semiconductor chip disposed to be electrically connected to the plurality of conductive structures and the connecting structure; and an optical engine disposed on the connecting structure and configured to transmit and receive a signal to and from the semiconductor chip.

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