Optical package module and photonic chip and manufacturing method thereof

Abstract

The present invention provides an optical packaging module and a photonic chip and a manufacturing method thereof, wherein the optical packaging module includes a carrier structure, a photonic chip arranged on the carrier structure, and a filling layer filled between the carrier structure and the photonic chip. The photonic chip includes a chip body and a plurality of stoppers formed on opposite sides of the chip body, so that the overflow distance of the filling layer is shortened by the plurality of stoppers.

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