Surface film and surface layer and methods for manufacturing the above.

TW202642263APending Publication Date: 2026-10-16SHIN ETSU CHEMICAL CO LTD
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Patent Information

Application Number
TW115110642
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-01
Filing Date
2026-03-20
Publication Date
2026-10-16

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Abstract

This invention provides a surface film that, for example, suppresses uneven film thickness caused by localized surface protrusions even in photolithography under a monochromatic exposure light source, thereby enabling more uniform light transmission than before. A surface film is characterized in that it is formed on the surface of the aforementioned surface film, satisfying one or more of conditions (A) to (B) [condition (A) circumscribed circle diameter is 5 mm or more, condition (B) height is 2.5 μm or more], and the number of protrusions formed from the same composition as the aforementioned surface film is 5 or less per m².
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