Electronic device and protecting assembly

Abstract

An electronic device comprises a circuit board and a protecting assembly. The circuit board has a board surface, on which a chip is disposed. The protecting assembly comprises a blocking member, a metal member, a heat dissipation member, and a thermal interface fluid. The blocking member is connected to the board surface and surrounds the chip, forming an overflow region between the blocking member and the chip. The blocking member has a gas guiding channel that connects the overflow region to an outside atmosphere. The metal member is disposed in the overflow region. The heat dissipation member covers the chip and the blocking member. The thermal interface fluid is located between the heat dissipation member and the chip. In response to the overflow of the thermal interface fluid into the overflow region and its solidification reaction with the metal member, the thermal interface fluid solidifies in the overflow region.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device having protective components. Prior Technology

[0002] When a computing chip is operating, it generates heat. To maintain the computing chip at a suitable operating temperature, the industry currently coats its surface with thermal interface materials, which then conduct the heat to a heat dissipation module. However, liquid thermal interface materials may pose a risk of overflow, causing them to spill onto electronic components (e.g., capacitors) on the substrate. Summary of the Invention

[0003] In view of this, an electronic device is provided. The electronic device includes a circuit board and a protective assembly. The circuit board has a board surface, on which a chip is disposed. The protective assembly includes a blocking member, a metal member, a heat sink, and a thermal interface fluid. The blocking member is connected to the board surface and surrounds the chip, forming an overflow area between the blocking member and the chip. The blocking member has a venting channel connecting the overflow area to the external atmosphere. The metal member is disposed in the overflow area. The heat sink covers the chip and the blocking member. The thermal interface fluid is located between the heat sink and the chip. In response to the thermal interface fluid overflowing into the overflow area and reacting with the metal member to solidify, the thermal interface fluid solidifies in the overflow area.

[0004] In some embodiments, the blocking element includes a venting element and an outer colloid. The venting element is connected to the board surface and surrounds the wafer, and a venting channel is disposed in the venting element. The outer colloid is connected to the venting element and surrounds the wafer, and an overflow area is formed between the outer colloid, the venting element, the wafer, and the heat sink. A metal component is disposed on the venting element and seals the venting channel. In response to the overflow of the thermal interface fluid into the overflow area and the opening of the venting channel, the thermal interface fluid and the metal component undergo a curing reaction.

[0005] In some embodiments, the breathable element is a mesh body having multiple meshes, and air channels are disposed in these meshes.

[0006] In some embodiments, the venting element is a porous plate.

[0007] In some embodiments, the porous plate is a sintered metal powder body.

[0008] In some embodiments, the protective component further includes an insulating adhesive disposed on the surface of the board.

[0009] In some embodiments, the blocking element further includes an inner colloid, which is attached to the board surface and directly connected to the four rings around the wafer, and the overflow area is located between the inner colloid and the outer colloid.

[0010] In some embodiments, a protective component is provided. The protective component is adapted to form an overflow region around a wafer and between a heat sink, allowing a thermal interface fluid to solidify in the overflow region. The protective component includes a barrier, a venting channel, and a metal component. The barrier surrounds the wafer and forms the overflow region with respect to the wafer. The barrier has a venting channel connecting the overflow region to the external atmosphere. The metal component is disposed in the overflow region. In response to the thermal interface fluid overflowing into the overflow region and reacting with the metal component, the thermal interface fluid solidifies in the overflow region.

[0011] In summary, in some embodiments, the electronic device confines the thermal interface fluid within an overflow area. When the thermal interface fluid overflows, it can open a venting channel, allowing outside air to enter the overflow area. Subsequently, the thermal interface fluid, outside air, and metal components can undergo a curing reaction to solidify within the overflow area. This ensures that the thermal interface fluid remains within the overflow area.

[0012] The following detailed description of the features and advantages of the present invention is sufficient to enable anyone skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the content disclosed in this specification, the scope of the patent application and the drawings, anyone skilled in the art can easily understand the relevant objectives and advantages of the present invention. Simple Explanation of the Diagram

[0013] Figure 1 is a schematic diagram of the appearance of the electronic device in some embodiments of the present invention. Figure 2 is a cross-sectional view of Figure 1 along the AA direction, showing that the thermal interface fluid has not yet overflowed and the air guide channel is closed. Figure 3 is a partial cross-sectional view of Figure 1 along the AA direction, showing that the thermal interface fluid overflows into the overflow area and the air guide channel is opened. Figure 4 is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the breathable element and the outer colloid. Figure 5A is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the breathable element is a mesh. Figure 5B is a schematic diagram of the mesh in Figure 5A. Figure 6A is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the first and second grids of the mesh. Figure 6B is a schematic diagram of the first grid in Figure 6A. Figure 6C is a schematic diagram of the second grid in Figure 6A. Figure 7 is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the breathable element consists of a first mesh and a second mesh that overlap each other. Figure 8A is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the porous plate is a sintered metal powder body. Figure 8B is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the porous plate is a perforated plate. Figure 9 is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the inner colloid and the outer colloid. Figure 10A is a schematic diagram of the appearance of the external colloid in some embodiments of the present invention (I). Figure 10B is a schematic diagram of the appearance of the external colloid in some embodiments of the present invention (II). Figure 10C is a schematic diagram of the appearance of the external colloid in some embodiments of the present invention (III). Figure 10D is a schematic diagram of the appearance of the external colloid in some embodiments of the present invention (IV). Implementation

[0014] Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the appearance of the electronic device in some embodiments of the present invention. Figure 2 is a cross-sectional view of Figure 1 along the AA direction, showing that the thermal interface fluid has not yet overflowed and the air duct is closed. In some embodiments, as shown in Figures 1 and 2, the electronic device 100 includes a circuit board 102 and a protective assembly 104. The circuit board 102 has a board surface 106, on which a chip 108 is provided. The protective assembly 104 includes a blocking member 110, a metal member 112, a heat sink 114, and a thermal interface fluid 116. The blocking member 110 is connected to the board surface 106 and surrounds the chip 108, forming an overflow area 118 between the blocking member 110 and the chip 108. The blocking member 110 has an air duct 120. The air duct 120 connects the overflow area 118 to an external atmosphere (as shown by the arrow in Figure 3). The metal member 112 is disposed in the overflow area 118. Heat sink 114 covers chip 108 and barrier 110. Thermal interface fluid 116 is located between heat sink 114 and chip 108. In response to thermal interface fluid 116 overflowing into overflow area 118 and reacting with metal component 112, thermal interface fluid 116 is solidified in overflow area 118.

[0015] Circuit board 102 may be, for example, an expansion card circuit board, a notebook computer circuit board, a computer circuit board, or a circuit board with a computing chip. Chip 108 may be, for example, but not limited to, a central processing unit (CPU), a microcontroller, a graphics processing unit (GPU), or other devices with high thermal design power (TDP). When chip 108 is being processed, the heat generated by chip 108 is conducted to a heat-generating surface 109 of chip 108, and then conducted through heat-generating surface 109 to heat sink 114 for heat dissipation.

[0016] The heat sink 114 has excellent thermal conductivity, allowing heat from the chip 108 to be conducted to it via the heating surface 109 and the thermal interface fluid 116. The heat sink 114 can exchange heat with the external atmosphere to maintain the temperature of the chip 108 at its operating temperature. The heat sink 114 can be made of, for example, a metal material, a composite metal material, a ceramic composite material, or a thermally conductive plastic. The heat sink 114 can also be, for example, a heat sink with heat dissipation fins or a water-cooled heat sink. Any heat dissipation method suitable for the chip 108 can be used, and the aforementioned heat dissipation materials are not limited to.

[0017] The thermal interface fluid 116 is a thermal grease, liquid metal, thermal gel, phase change material (PCM), high-temperature thermal paste, or other liquid, paste, or gel-like thermal interface material that exhibits a flowable state at room temperature or high temperature (e.g., 60°C to 180°C). The thermal interface fluid 116 contains a metal element that can cause the liquid metal to solidify (this metal element may be, for example, any one of gallium (Ga), gallium-indium (Ga-In), gallium-indium-tin (Ga-In-Sn), or a combination of any two or more of the aforementioned metals). The thermal interface fluid 116 is coated on the heating surface 109. When the heat sink 114 covers and presses against the heating surface 109, the thermal interface fluid 116 can fill the rough surfaces of the heating surface 109 and the heat sink 114. Therefore, the contact area between the heating surface 109 and the heat sink 114 is more complete, so as to improve the heat transfer efficiency of the heating surface 109 in transferring heat energy to the heat sink 114.

[0018] Metal component 112 is used to open the venting channel 120 when the thermal interface fluid 116 overflows, and to solidify with the thermal interface fluid 116 as liquid metal (described in detail later). Normally, metal component 112 closes the venting channel 120 of the blocking component 110. When the thermal interface fluid 116 undergoes a solidification reaction with metal component 112, the structure of metal component 112 is disrupted, causing metal component 112 to open the venting channel 120, connecting the overflow area 118 to the external atmosphere. Metal component 112 can be a metal sheet (such as aluminum foil) or metal particles (such as aluminum powder).

[0019] The blocking member 110 is used to prevent the thermal interface fluid 116 from overflowing the overflow area 118 and to introduce external air into the overflow area 118. To distinguish the blocking members 110 located at different positions on the board surface 106, the blocking members 110 are divided into blocking member 110a and blocking member 110b in the figure. Blocking member 110a is disposed on the side of the overflow area 118 away from the chip 108 and surrounds the chip 108 to close the space between the board surface 106, the chip 108, and the heat sink 114 (this space is the overflow area 118). When the thermal interface fluid 116 overflows, blocking member 110a can block the thermal interface fluid 116 within the overflow area 118 to prevent the thermal interface fluid 116 from contacting other electronic components on the circuit board 102. Blocking member 110b is disposed between the chip 108 and blocking member 110a and has a venting channel 120. In response to the overflow of the thermal interface fluid 116, the blocking member 110b can open the air passage 120 to introduce external air into the overflow area 118. The blocking member 110 can be made of elastic materials such as rubber, foam, sponge, or silicone. The blocking member 110 can have a compressed state and a released state due to its own elasticity. When the heat sink 114 covers the wafer 108, it can compress the blocking member 110, causing the blocking member 110 to fill the gap between the heat sink 114 and the board surface 106.

[0020] For example, the height of the blocking member 110a is substantially equal to that of the chip 108, while the height of the blocking member 110b is lower than that of the blocking member 110a. Here, the blocking member 110b can receive the thermal interface fluid 116 overflowing from the heating surface 109. It should be noted that the height of the blocking member 110a when not compressed exceeds the height of the chip 108. After the blocking member 110a is compressed by the heat sink 114, the height of the blocking member 110a can be aligned with the height of the chip 108 to ensure airtightness between the blocking member 110a and both the board surface 106 and the heat sink 114.

[0021] Metal component 112 is disposed on barrier component 110b to shield the air passage 120 of barrier component 110b, temporarily preventing external air from entering overflow area 118 through air passage 120. After metal component 112 undergoes a solidification reaction with thermal interface fluid 116, air passage 120 will be opened, allowing external air to enter overflow area 118 (details to follow). Air passage 120 may be formed on barrier component 110b by means of sintering, three-dimensional printing, etching, or material bonding.

[0022] In some embodiments, as shown in FIG2, before the heat sink 114 covers the wafer 108, the metal component 112 can cover the blocking component 110b. A first contact surface 112a of the metal component 112 contacts the blocking component 110b to shield the gas channel 120. A second contact surface 112b of the metal component 112 faces the overflow area 118. After the metal component 112 is installed, the heat sink 114 is then covered onto the wafer 108, forming a closed space in the overflow area 118. It should be noted that since the gas channel 120 is connected to the external atmosphere, the first contact surface 112a may undergo an oxidation reaction upon contact with the external atmosphere (e.g., aluminum reacts with oxygen to form aluminum oxide). The second contact surface 112b is located within the overflow area 118; before the gas channel 120 is open, the second contact surface 112b does not have sufficient oxygen for oxidation, thus maintaining the properties of the raw material.

[0023] Please refer to Figures 2 and 3. Figure 3 is a partial cross-sectional view of Figure 1 along the AA direction, showing the thermal interface fluid overflowing into the overflow area and the air duct being opened. In some embodiments, as shown in Figures 2 and 3, when the thermal interface fluid 116 overflows into the overflow area 118, the thermal interface fluid 116 contacts the second contact surface 112b of the metal component 112. The thermal interface fluid 116 can undergo a solidification reaction with the contacted metal component 112, causing the contacted portion of the metal component 112 to be eroded and the air duct 120 to be opened, allowing external air to enter the overflow area 118 through the air duct 120. Subsequently, the thermal interface fluid 116 can undergo a solidification reaction with the metal component 112 and the external air, causing the thermal interface fluid 116 to transform from a liquid into a solid solution or a solid compound (e.g., a gallium aluminum alloy (GaAl₃)). This serves to retain the thermal interface fluid 116 in the overflow area 118 or prevent the thermal interface fluid 116 from seeping out of the barrier 110.

[0024] In some embodiments, when gallium (Ga) in the thermal interface fluid 116 undergoes an alloying reaction with aluminum (Al), gallium atoms diffuse into the aluminum lattice structure, forming new compounds through metallic bonds, such as, but not limited to, gallium-aluminum alloys (GaAl₃). This process involves chemical reactions and rearrangement of atomic levels, generating a solid alloy with a specific stoichiometric ratio, as shown in the following reaction formula: Ga(l) + 3Al(s) → GaAl₃(s). When liquid gallium comes into contact with aluminum powder, gallium rapidly penetrates and dissolves some of the aluminum, subsequently forming a solid alloy through an exothermic reaction. The resulting GaAl₃ is an intermetallic compound, a form of alloy, with a fixed crystal structure and distinct physical properties (e.g., hardness and melting point), which are quite different from pure gallium or pure aluminum. Strictly speaking, this is a spontaneous alloying reaction, and the product is a gallium-aluminum alloy (GaAl₃). Furthermore, the gallium-aluminum alloy (GaAl₃) formed after the reaction can also act as an effective barrier to prevent further overflow of the thermal interface fluid 116.

[0025] In some embodiments, when the gas channel 120 is open, the first contact surface 112a can undergo an oxidation reaction with the external atmosphere, and the resulting alumina can effectively block the thermal interface fluid 116. This is because alumina (Al₂O₃) is a very stable compound with a high melting point (approximately 2072°C) and chemical inertness. Gallium or gallium-based liquid metals cannot undergo a significant chemical reaction with alumina at room temperature or under normal conditions, as alumina will not be reduced or decomposed by gallium. Therefore, it can still prevent the thermal interface fluid 116 from continuously corroding the metal or other electronic components.

[0026] In some embodiments, when outside air enters the overflow area 118, the thermal interface fluid 116 can undergo an oxidation reaction with the outside air to form an oxide film (not shown) on the surface of the thermal interface fluid 116. This oxide film can cover the unoxidized thermal interface fluid 116, causing the thermal interface fluid 116 to stop or slow down its flow in the overflow area 118. Furthermore, because the thermal interface fluid 116 is covered by the oxide film, the thermal interface fluid 116 cannot permeate out of the barrier 110.

[0027] In some embodiments, the metal component 112 and the thermal interface fluid 116 may undergo oxidation reactions with atmospheric air, after which the thermal interface fluid 116 mixes with the oxides of the metal component 112 and the external atmosphere, increasing the viscosity of the thermal interface fluid 116. This allows the thermal interface fluid 116 to remain in the overflow area 118 or prevents the thermal interface fluid 116 from permeating out of the blocking member 110.

[0028] Please refer to Figure 4, which is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the venting element and the external colloid. In some embodiments, as shown in Figure 4, the blocking element 110 includes a venting element 122 and an external colloid 124. The venting element 122 is connected to the board surface 106 and surrounds the wafer 108, and a venting channel 120 is disposed on the venting element 122. The external colloid 124 is connected to the venting element 122 and surrounds the wafer 108. An overflow area 118 is formed between the external colloid 124, the venting element 122, the wafer 108, and the heat sink 114. A metal element 112 is disposed on the venting element 122 and closes the venting channel 120. In response to the overflow of the thermal interface fluid 116 into the overflow area 118 and the opening of the venting channel 120, the thermal interface fluid 116 and the metal element 112 undergo a curing reaction.

[0029] The breathable component 122 can be made of a material with multiple pores, such as hydrophobic polymer foams composed of polyvinylidene fluoride (PVDF), polytetrafluoroethylene (PTFE), polyurethane (PU), or polystyrene (PS); or hydrophobic fiber-based structures composed of carbon fiber, aramid fiber, or glass fiber, which have been specially treated to form a microporous structure. In other embodiments, hydrophobic microporous membranes may also be coated on the surface of the breathable component 122. However, the main purpose of these arrangements is to allow gas molecules to pass through while repelling moisture to prevent liquid penetration. The outer colloid 124 can be an elastic material such as glue, silicone, polyurethane, aerogel, or epoxy resin.

[0030] Please refer to Figures 5A and 5B. Figure 5A is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the venting element is a mesh. Figure 5B is a schematic diagram of the mesh in Figure 5A. In some embodiments, as shown in Figures 5A and 5B, the venting element is a mesh 126, which has multiple meshes 128, and air channels 120 are disposed in these meshes 128. Specifically, the connections of these meshes 128 have gaps to allow external air to flow through. The gaps connecting the overflow area 118 and the outside of the mesh 126 are the air channels 120. Taking aluminum powder as an example, the aluminum powder can fill the gaps between the meshes 128 and each mesh 128, so that external air cannot temporarily enter the overflow area 118 through the air channels 120 (here referring to the gaps). The size of the meshes 128 of the mesh 126 can be determined according to the airtightness between the metal part 112 and the air channels 120. For example, the metal part 112 is aluminum powder, and the mesh 128 can be selected to correspond to the size of the aluminum powder. If the selected mesh 128 size is large, more aluminum powder needs to be filled in each mesh 128. Conversely, if the selected mesh 128 size is small, less aluminum powder can be filled in each mesh 128. In some embodiments, the breathable part 122 can be a single mesh 126 or multiple overlapping meshes 126.

[0031] Please refer to Figures 6A, 6B, and 6C. Figure 6A is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the first and second grids of the mesh. Figure 6B is a schematic diagram of the first grid in Figure 6A. Figure 6C is a schematic diagram of the second grid in Figure 6A. In some embodiments, as shown in Figures 6A, 6B, and 6C, the mesh 128 includes a plurality of first grids 128a and a plurality of second grids 128b. These first grids 128a are adjacent to the wafer 108, and these second grids 128b are located between these first grids 128a and the outer colloid 124. Gas channels 120 are disposed in these second grids 128b, and metal parts 112 are disposed in these second grids 128b. The size of the first grid 128a is larger than the size of the second grid 128b. Specifically, the first grid 128a does not have gas channels 120, and external atmosphere cannot enter the overflow area 118 through the first grid 128a. The gap between the second mesh 128b and the outside of the overflow area 118 and the mesh body 126 forms the air guide channel 120. When no overflow occurs, the metal component 112 can seal the air guide channel 120 of the second mesh 128b. Since the size of the first mesh 128a is larger than the size of the second mesh 128b, the metal component 112 can tightly seal the air guide channel 120 using either metal particles or metal sheets. Furthermore, when the thermal interface fluid 116 overflows into the first mesh 128a, the first mesh 128a can absorb part or all of the thermal interface fluid 116 through capillary action. Therefore, even when the overflow rate of the thermal interface fluid 116 exceeds the absorption capacity of the first mesh 128a, the thermal interface fluid 116 can still undergo a solidification reaction with the metal component 112 and the external atmosphere when the air guide channel 120 is open in the second mesh 128b.

[0032] Please refer to Figure 7, which is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the venting element is an overlapping first mesh and a second mesh. In some embodiments, as shown in Figure 7, the venting element 122 is a mesh 126. The mesh 126 includes a first mesh 126a and a second mesh 126b. The first mesh 126a has a plurality of first grids 128a, and the second mesh 126b has a plurality of second grids 128b. The first mesh 126a overlaps with the second mesh 126b, and the second mesh 126b is located between the first mesh 126a and the plate surface 106. The metal part 112 is disposed in these second grids 128b, and the air guiding channel 120 is disposed in these second grids 128b.

[0033] For example, if the metal component 112 is a metal sheet, the metal sheet can be sandwiched between the first mesh 126a and the second mesh 126b, so that the metal sheet seals the air passage 120. If the metal component 112 is metal particles, the metal particles can be applied to the first mesh 126a and filled into the air passage 120, so that the metal particles seal the air passage 120. The size of the first mesh 128a is larger than the size of the second mesh 128b. When the thermal interface fluid 116 overflows to the overflow area 118, the first mesh 128a can absorb the thermal interface fluid 116 through capillary action, thereby slowing down the flow rate of the thermal interface fluid 116 and guiding it to the second mesh 128b. Then, the thermal interface fluid 116 can open the air passage 120 of the second mesh 128b, so that the thermal interface fluid 116 undergoes a solidification reaction between the first mesh 126a and the second mesh 126b.

[0034] Please refer to Figures 8A and 8B. Figure 8A is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the porous plate is a sintered metal powder body. Figure 8B is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing that the porous plate is a perforated plate. In some embodiments, the venting member 122 is a porous plate. The porous plate has multiple holes, which can be single-direction through holes or interconnected holes in multiple directions. In the embodiment of Figure 8A, the porous plate is a sintered metal powder body 130a. The sintered metal powder body 130a is formed by sintering metal powder. After the metal powder is sintered into a ball, multiple interconnected holes 132a will be formed at the joints. The holes 132a connecting the overflow area 118 and the outside of the venting member 122 are the air guiding channels 120.

[0035] In the embodiment shown in Figure 8B, the porous plate is a perforated plate 130b with a hole 132b. The plate surface 106 has a protrusion 134a and a recess 134b, with the recess 134b extending to the side of the circuit board 102 to connect to the external atmosphere. The perforated plate 130b is connected to the protrusion 134a, and the hole 132b connects the overflow area 118 to the external atmosphere. The hole 132b serves as the air guide channel 120. When the metal part 112 covers the perforated plate 130b, the metal part 112 can shield the hole 132b to prevent external atmosphere from entering the overflow area 118. When the thermal interface fluid 116 erodes the metal part 112, the hole 132b can be opened to allow external atmosphere to flow into the overflow area 118.

[0036] Please refer to Figure 9, which is a partial cross-sectional view of the electronic device in some embodiments of the present invention, showing the relative positions of the inner and outer colloids. In some embodiments, as shown in Figure 9, the blocking member 110 further includes an inner colloid 136. The inner colloid 136 is connected to the board surface 106 and directly connected to the four rings around the chip 108, and the overflow area 118 is located between the inner colloid 136 and the outer colloid 124. The material properties of the inner colloid 136 and the outer colloid 124 are similar; please refer to the description of the outer colloid 124. It should be noted that after the heat sink 114 compresses the inner colloid 136, the inner colloid 136 can fill the space around the chip 108 to form a first flow-blocking structure that blocks the thermal interface fluid 116.

[0037] In some embodiments, as shown in Figures 2, 4, 5A, 6A, 7, 8A, and 8B, the protective component 104 includes an insulating adhesive 138. The insulating adhesive 138 is disposed on a board surface 106. The insulating adhesive 138 can be applied to the board surface 106 to cover electronic components (e.g., capacitors) on the circuit board 102. The insulating adhesive 138 can be, for example, epoxy acrylate (EA), acrylate resin, or silicone.

[0038] Please refer to Figures 10A, 10B, 10C, and 10D. Figures 10A to 10D are schematic diagrams (a) to (b) of the appearance of the outer colloid in some embodiments of the present invention. As shown in Figures 10A and 10B, in some embodiments, the outer colloid 124 has a first connecting surface 124a and a second connecting surface 124b. The first connecting surface 124a is connected to the plate surface 106, and the heat sink 114 is pressed against the second connecting surface 124b. The second connecting surface 124b is formed as a polygon (as shown in Figure 10A, the second connecting surface 124b is serrated, and in Figure 10B, the second connecting surface 124b is wavy). When the heat sink 114 is pressed against the second connecting surface 124b, the second connecting surface 124b can evenly distribute the pressure applied by the heat sink 114 to the second connecting surface 124b through its shape, so that the outer colloid 124 is tightly attached to the plate surface 106 and the heat sink 114. In some embodiments, as shown in Figures 10C and 10D, the outer colloid 124 also has a hollow portion 124c. When the heat sink 114 is pressed against the second connecting surface 124b, the hollow portion 124c will be deformed by compression and distribute the pressure, so that the heat sink 114 can be compressed to a uniform height.

[0039] In summary, in some embodiments, the electronic device 100 confines the thermal interface fluid 116 within the overflow area 118. When the thermal interface fluid 116 overflows, it can open the venting channel 120, allowing external air to enter the overflow area 118. Subsequently, the thermal interface fluid 116, the external air, and the metal component 112 can undergo a curing reaction to solidify within the overflow area 118. This ensures that the thermal interface fluid 116 is retained within the overflow area 118.

[0040] The embodiments described above are only for illustrating the technical ideas and features of this case. Their purpose is to enable those skilled in the art to understand the content of this case and implement it accordingly. They should not be used to limit the scope of the patent in this case. That is, all equivalent changes or modifications made in accordance with the spirit disclosed in this case should still be covered within the scope of the patent application in this case.

[0041] 100: Electronic devices 102: Circuit Board 104: Protective Components 106: Plate surface 108: Chip 109: Heating surface 110, 110a, 110b: Blocking components 112: Metal parts 112a: First contact surface 112b: Second contact surface 114: Heat sink 116: Thermal interface fluid 118: Overflow Area 120: Air duct 122: Breathable parts 124: External colloid 124a: First connecting surface 124b: Second connecting surface 124c: Hollowed-out section 126: Net 126a: First network 126b: Second network 128: Grid 128a: First grid 128b: Second grid 130a: Sintered metal powder 130b: Perforated plate 132a, 132b: Holes 134a:convex part 134b: concave part 136: Internal colloid 138: Insulating adhesive

Claims

1. An electronic device comprising: A circuit board having a surface on which a chip is disposed; A protective component includes: a blocking member connected to the surface of the plate and surrounding the wafer, forming an overflow area between the blocking member and the wafer, the blocking member having a venting channel connecting the overflow area to an external atmosphere; a metal member disposed in the overflow area; a heat sink covering the wafer and the blocking member; and a thermal interface fluid located between the heat sink and the wafer; wherein, in response to the thermal interface fluid overflowing into the overflow area and undergoing a curing reaction with the metal member, the thermal interface fluid is cured in the overflow area.

2. The electronic device as described in claim 1, wherein, The blocking component includes: a venting component connected to the surface of the plate and surrounding the wafer, with the air guiding channel disposed in the venting component; and an outer colloid connected to the venting component and surrounding the wafer, with the overflow area formed between the outer colloid, the venting component, the wafer, and the heat dissipation component; wherein, the metal component is disposed on the venting component and seals the air guiding channel; in response to the thermal interface fluid overflowing into the overflow area and opening the air guiding channel, the thermal interface fluid and the metal component undergo a solidification reaction.

3. The electronic device as described in claim 2, wherein, The breathable component is a mesh body with multiple grids, and the air guide channel is disposed in these grids.

4. The electronic device as described in claim 2, wherein, The venting component is a porous plate.

5. The electronic device as described in claim 4, wherein, The porous plate is a sintered metal powder body.

6. The electronic device as described in claim 2, wherein, The blocking component also includes an inner colloid, which is attached to the surface of the board and directly connected to the four rings around the wafer. The overflow area is located between the inner colloid and the outer colloid.

7. The electronic device as described in claim 1, wherein, The protective component further includes an insulating adhesive disposed on the surface of the plate.

8. A protective component adapted to form an overflow region between a wafer and a heat sink, such that a thermal interface fluid is solidified in the overflow region, the protective component comprising: A blocking element surrounds the wafer and forms the overflow area between the blocking element and the wafer. The blocking element has a gas guide channel that connects the overflow area to an external atmosphere. And a metal component disposed in the overflow area; wherein, in response to the thermal interface fluid overflowing into the overflow area and reacting with the metal component to solidify, the thermal interface fluid solidifies in the overflow area.

9. The protective component as described in claim 8, wherein, The blocking component includes: a venting element surrounding the wafer, with the air channel disposed on the venting element; and an outer colloid connected to the venting element and surrounding the wafer, wherein the overflow area is formed between the outer colloid, the venting element, the wafer, and the heat dissipation component; wherein the metal component is disposed on the venting element and seals the air channel; in response to the thermal interface fluid overflowing into the overflow area and opening the air channel, the thermal interface fluid and the metal component undergo a solidification reaction.

10. The protective component as described in claim 9, wherein, The breathable component is a mesh body with multiple grids, and the air guide channel is disposed in these grids.

11. The protective component as described in claim 9, wherein, The venting component is a porous plate.

12. The protective component as described in claim 11, wherein, The porous plate is a sintered metal powder body.

13. The protective assembly as claimed in claim 9, the blocking member further includes an inner colloid directly connected to the four rings surrounding the wafer, the overflow area being located between the inner colloid and the outer colloid.

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