Electronic device

Abstract

An electronic device includes a housing, a plurality of frequency selective surface elements and a plurality of electronic elements. The housing includes a heat dissipation area. The frequency selective surface elements are disposed to the heat dissipation area of the housing. Each of the frequency selective surface elements includes a hole. The electronic elements are disposed in the housing, and the heat energy generated by the electronic elements leaves the heat dissipation area through the holes of the frequency selective surface elements.

Description

[Technical Field]

[0001] This invention relates to an electronic device. [Previous Technology]

[0002] The electronic components used in modern electronic devices (such as arithmetic units, data processing units, and solid-state drives) are operating at increasingly faster speeds, resulting in increased noise and heat generation. To filter out this noise, electronic devices can use metal shielding covers to protect the components. However, these metal shielding covers are closed, leading to poor heat dissipation and convection. Consequently, the electronic components cannot effectively dissipate heat, resulting in poor overall heat dissipation performance of the electronic device. [Summary of the Invention]

[0003] The present invention provides an electronic device that can filter out noise and has better heat dissipation performance.

[0004] The electronic device of the present invention includes a housing, a plurality of frequency selective surface elements, and a plurality of electronic components. The housing includes a heat dissipation area. The frequency selective surface elements are disposed in the heat dissipation area of ​​the housing. Each frequency selective surface element includes an opening. The electronic components are disposed inside the housing, and the heat generated by the electronic components leaves the heat dissipation area through the openings of the frequency selective surface elements.

[0005] Based on the above, the electronic device of the present invention filters out noise generated during the operation of electronic components through a frequency selective surface element, and dissipates heat from the electronic components through openings in the frequency selective surface element. Therefore, the electronic device can filter out noise generated by electronic components while having better heat dissipation performance.

Implementation Method

[0006] FIG1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG2 is a partial enlarged view of the electronic device of FIG1. ​​FIG3 is a schematic diagram of the frequency selective surface element of FIG1. ​​Referring simultaneously to FIG1 to FIG3, the electronic device 100 includes a housing 110, a plurality of frequency selective surface (FSS) elements 120 and a plurality of electronic components 130. In this embodiment, the electronic device 100 is, for example, a notebook computer. The electronic components 130 include a processing unit (CPU) and a data processing unit (GPU). The electronic components 130 may be disposed on a circuit board (not shown), but are not limited thereto. The housing 110 includes a heat dissipation area 112 and an accommodating space P1 adjacent to the heat dissipation area 112. The frequency selective surface element 120 is disposed in the heat dissipation area 112 of the housing 110 for filtering noise and has an opening 121. These electronic components 130 are disposed within the housing space P1 of the housing 110 so that the heat generated by the electronic components 130 during operation can be discharged from the heat dissipation area 112 through these openings 121.

[0007] In this way, the electronic device 100 can filter out the noise generated by the electronic component 130 through the frequency selective surface element 120, and at the same time, it can dissipate heat through the opening 121 of the frequency selective surface element 120, so as to improve the heat dissipation efficiency of the electronic device 100.

[0008] As shown in Figures 1 and 2, the heat dissipation area 112 in this embodiment is at least one sidewall of the housing 110. The housing 110 includes four sidewalls 111a and 111b. One sidewall 111a of the housing 110 is connected to the frequency selective surface element 120, and the opening 121 serves as a communication port between the housing 110's accommodating space P1 and the external environment to dissipate the heat generated by the electronic components 130. The sidewall 111a forms an open sidewall through the opening 121 of the frequency selective surface element 120. The other three sidewalls 111b of the housing 110 may be closed sidewalls, that is, the sidewalls 111b do not include a communication port that can communicate with the external environment. The housing 110 is made of plastic, but is not limited to this. In an embodiment not shown, the heat dissipation area 112 may be the four sidewalls of the housing 110, and the frequency selective surface element 120 may be connected to the four sidewalls to form four open sidewalls 111a. The casing 110 can be made of metal.

[0009] As shown in Figures 2 and 3, the frequency selective surface element 120 includes a plurality of connected borders 122 surrounding an opening 121. In this embodiment, the frequency selective surface element 120 is a one-piece metal component. The shape formed by the interconnection of these borders 122 defines the shape of the opening 121, but is not limited thereto. The number of these borders 122 can be one or an even number greater than two, but is not limited thereto. The frequency selective surface element 120 includes at least two axes of symmetry L1 and L2, which can be perpendicular to each other, but are not limited thereto. In this embodiment, the frequency selective surface element 120 includes four borders 122, which are interconnected to form a square, making the opening 121 square in shape. In an embodiment not shown, the frequency selective surface element 120 may have only one border 122, which may be circular, and the opening 121 may be a circular opening. In an embodiment not shown, the sidewall 111a of the housing 110 may be a carrier plate for the frequency selective surface element 120. The frame 122 may be a metal layer plated on the sidewall 111a, and the opening 121 may be located on the sidewall 111a. The sidewall 111a may be made of plastic. This invention does not limit the manufacturing method or type of the frequency selective surface element 120.

[0010] Each frequency selective surface element 120 further includes a plurality of lumped elements 123, which are respectively disposed on these frames 122. In this embodiment, the lumped elements 123 are inductive elements, such as a 0402 inductor or a 0201 inductor, but are not limited thereto. The frequency selective surface element 120 can be regarded as a resonant circuit of an inductor and a capacitor connected in series. Referring to the resonant frequency formula of the resonant circuit shown below, Lt is the sum of the inductance value of the frame 122 and the inductance value of these lumped elements 123, and Ct is the sum of the capacitance value of the frame 122 and the capacitance value of these lumped elements 123. Since these lumped elements 123 are inductive elements in this embodiment, the total capacitance Ct is the capacitance of the frame 122.

[0011] In frequency selective surface elements without a lumped element 123, the frequency selective surface element increases the total inductance Lt or total capacitance Ct by increasing its area to adjust the resonant frequency to a specific value. This results in a frequency selective surface element without a lumped element 123 having an excessively large volume (area) that is inconvenient to use. In this embodiment, the frequency selective surface element 120 increases the total inductance Lt by providing a lumped element 123, thereby reducing the area of ​​the frequency selective surface element 120 and making it easier to use. In an embodiment not shown, the lumped element 123 may be a capacitor element or a combination of capacitor and inductor elements to increase the total capacitance Ct and / or total inductance Lt of the frequency selective surface element 120.

[0012] The number of these lumped elements 123 is an even number greater than 2 and they are symmetrically arranged. In this embodiment, the number of these lumped elements 123 can be equal to the number of these borders 122, and each lumped element 123 is located at a geometric center C of the corresponding border 122, but is not limited thereto. As shown in FIG3, the number of lumped elements 123 in this embodiment is four, and the four lumped elements 123 are respectively arranged at the center of the corresponding four borders 122. Since the frequency selective surface element 120 can be regarded as a resonant circuit of inductor and capacitor in series, the frequency selective surface element 120 can increase the total inductance Lt or the total capacitance Ct through these lumped elements 123 to reduce the volume of the frequency selective surface element 120, and through these lumped elements 123 symmetrically arranged with symmetry axes L1 and L2, the frequency selective surface element 120 can have a more consistent filtering effect on noise incident from different directions.

[0013] In an embodiment not shown, the frequency selection surface element 120 may include four arc-shaped borders 122 and four lumped elements 123. The four arc-shaped borders may surround a circular opening, and the four lumped elements 123 may be arranged in pairs at the middle of adjacent ends of the four arc-shaped borders 122.

[0014] FIG4 is a schematic diagram of an electronic device according to another embodiment of the present invention. Referring to FIG1 and FIG4 simultaneously, the electronic device 100a of this embodiment is similar to the aforementioned embodiment, except that the heat dissipation area 112a of this embodiment is located within the accommodating space P1 of the housing 110. The electronic device 100a further includes a cover plate 160 and a connector 170. These frequency selective surface elements 120 are interconnected in the heat dissipation area 112a to enclose a noise shielding space P2. Electronic components 130 may be disposed in the noise shielding space P2, located within the heat dissipation area 112a. The cover plate 160 is coupled to these frequency selective surface elements 120 and covers the electronic components 130 located within the noise shielding space P2. The cover plate 160 is connected to the housing 110 or the circuit board through the connector 170, and has a gap between it and these frequency selective surface elements 120. That is, the cover plate 160 does not directly contact the frequency selective surface elements 120. The openings 121 of these frequency selective surface elements 120 serve as communication ports between the accommodating space P1 and the noise shielding space P2. Heat generated by the electronic component 130 exits the noise shielding space P2 (heat dissipation area 112a) through these openings 121 and exits the electronic device 100a through a heat dissipation hole (not shown) in the housing 110. These frequency selective surface elements 120 may be disposed on a circuit board, but are not limited thereto. In this embodiment, the cover plate 160 is a metal plate. In an embodiment not shown, the cover plate 160 may be provided with frequency selective surface elements.

[0015] In this embodiment, the frequency selective surface elements 120 are arranged in a C-shape to form an opening OP, but are not limited thereto. A line 150 of the electronic device 100a is connected to the electronic component 130 located within the noise shielding space P2 and exits the noise shielding space P2 from the opening OP. An antenna (not shown) of the electronic device 100a is disposed outside the noise shielding space P2. The arrangement of the frequency selective surface elements 120 is not limited to this embodiment. In an embodiment not shown, the number of heat dissipation areas may be two; one heat dissipation area may be the side wall 111a of the housing 110, and the other heat dissipation area may be located within the accommodating space P1 of the housing 110. The arrangement of the frequency selective surface elements 120 may be a combination of the foregoing embodiments. In an embodiment not shown, the frequency selective surface elements 120 may completely surround the noise shielding space P2 without forming an opening OP.

[0016] In summary, the electronic device of the present invention filters out noise generated during the operation of electronic components through a frequency selective surface element, and dissipates heat from the electronic components through openings in the frequency selective surface element. Therefore, the electronic device can filter out noise generated by electronic components while also having better heat dissipation performance. [Simplified Explanation of the Diagram]

[0017] FIG1 is a schematic diagram of an electronic device according to an embodiment of the present invention. FIG2 is a partial enlarged view of the electronic device of FIG1. ​​FIG3 is a schematic diagram of the frequency selection surface element of FIG1. ​​FIG4 is a schematic diagram of an electronic device according to another embodiment of the present invention.

Claims

1. An electronic device comprising: A housing includes a heat dissipation area; a plurality of frequency selective surface elements disposed in the heat dissipation area of ​​the housing, each of the frequency selective surface elements including an opening and at least one frame surrounding the opening; and a plurality of electronic components disposed within the housing, wherein heat generated by the electronic components exits the heat dissipation area through the opening of each of the frequency selective surface elements.

2. The electronic device as claimed in claim 1, wherein the heat dissipation area is at least one sidewall of the housing.

3. The electronic device as claimed in claim 1, wherein the number of the at least one frame is plurality of.

4. The electronic device as claimed in claim 3, wherein the number of the at least one frame is even.

5. The electronic device as claimed in claim 3, wherein each of the frequency-selective surface elements includes a plurality of lumped elements connected to each of the frame elements.

6. The electronic device as claimed in claim 5, wherein each of the lumped elements is located at a geometric center of each of the frames.

7. The electronic device as claimed in claim 5, wherein the number of lumped elements of each of the frequency-selective surface elements is equal to the number of the borders.

8. The electronic device as claimed in claim 1, wherein the number of the at least one frame is one, and the frame is circular.

9. The electronic device as claimed in claim 1, wherein the housing includes a receiving space, the heat dissipation area is located within the receiving space, and the frequency selective surface elements are interconnected to surround the electronic elements.

10. The electronic device as claimed in claim 9 further includes a cover plate that covers the electronic components and has a gap between it and the frequency-selective surface elements.

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