Wired electronic device and manufacturing method thereof

TW202642307APending Publication Date: 2026-10-16CHICONY ELECTRONICS CO LTD
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Patent Information

Application Number
TW114114074
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-14
Publication Date
2026-10-16

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Abstract

A wired electronic device includes a housing, a circuit board, and a wire assembly. The housing has an internal space and an assembly hole communicated with the internal space. The circuit board is disposed in the internal space. The wire assembly includes a connecting structure and a cable. The connecting structure is pluggably engaged with the assembly hole. The cable is connected to the connecting structure and is configured to electrically couple the circuit board through the assembly hole when the connecting structure is engaged with the assembly hole.
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