Semiconductor devices, power modules and artificial intelligence computing systems

TW202642409APending Publication Date: 2026-10-16AOI ELECTRONICS CO LTD
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Patent Information

Application Number
TW115104184
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2026-02-03
Publication Date
2026-10-16

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Abstract

This invention provides a semiconductor device, comprising: a semiconductor element; a first sealing portion sealing the semiconductor element; an inductor portion disposed above the first sealing portion and electrically connected to the semiconductor element; and a second sealing portion disposed above the first sealing portion and sealing the inductor portion, wherein the second sealing portion comprises a magnetic material. This invention also provides a power module having a semiconductor device. Furthermore, this invention provides an artificial intelligence computing system, comprising: a substrate; a power supply portion located above the substrate; an artificial intelligence semiconductor disposed above the substrate; and a power module that converts the voltage of the power supply portion into a voltage required by the artificial intelligence semiconductor.
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