Image processing apparatus and image processing method

Abstract

An image processing apparatus and method are provided that can easily evaluate the impact of defect candidates found on a patterned surface being transferred to a wafer. The image processing apparatus 10 of this embodiment includes: a first acquisition unit 11 that acquires an evaluation image A1 based on the imaging result of a patterned surface 52 on which the pattern 51 is formed in an evaluation object mask 50; a second acquisition unit 12 that acquires conversion parameters relating the imaging image B1 of the patterned surface 52 to a transferred image E1 in the case where the patterned surface 52 has been transferred to a wafer 54 by an exposure apparatus; and a third acquisition unit 13 that applies the conversion parameters to the evaluation image A1 and acquires a converted evaluation image F1.

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