Method for fabricating chip-based integrated circuit inductors without chip terminals

TW202642552APending Publication Date: 2026-10-16HUNAN CHUANGYI ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
TW114127003
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-11
Filing Date
2025-07-17
Publication Date
2026-10-16

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Abstract

This invention provides a method for preparing a chip inductor without a chip terminal, comprising the following steps: S1, multi-axis winding of a hollow coil on a winding jig, and fixing the hollow coil to a conductive strip; S2, positioning the conductive strip containing the hollow coil into the mold cavity of a forming machine, injecting metal magnetic powder and stamping to form an inductor core; S3, subjecting the inductor core to hot-press curing treatment, wherein the hot-press curing temperature is not lower than 100°C, the pressure is not lower than 0.5MPa, and the hot-press curing time is not lower than 5 minutes, so that the inductor core is cured; S4, forming an insulating layer of not less than 3μm on the surface of the inductor core using high-atomization spraying technology; S5, exposing the coil end of the inductor core using laser delamination or micro-polishing technology to form an inner electrode; S6, sequentially depositing a copper layer, a nickel layer, and a tin layer using roll-to-roll continuous electroplating technology to form an outer electrode; S7, cutting the conductive strip, separating qualified inductors, and packaging them.
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