Method for fabricating chip-based integrated circuit inductors without chip terminals
TW202642552APending Publication Date: 2026-10-16HUNAN CHUANGYI ELECTRONIC TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114127003
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-11
- Filing Date
- 2025-07-17
- Publication Date
- 2026-10-16
Smart Images

Figure TWG2TA001080471_001 
Figure TWG2TA001080471_002 
Figure TWG2TA001080471_003
Abstract
This invention provides a method for preparing a chip inductor without a chip terminal, comprising the following steps: S1, multi-axis winding of a hollow coil on a winding jig, and fixing the hollow coil to a conductive strip; S2, positioning the conductive strip containing the hollow coil into the mold cavity of a forming machine, injecting metal magnetic powder and stamping to form an inductor core; S3, subjecting the inductor core to hot-press curing treatment, wherein the hot-press curing temperature is not lower than 100°C, the pressure is not lower than 0.5MPa, and the hot-press curing time is not lower than 5 minutes, so that the inductor core is cured; S4, forming an insulating layer of not less than 3μm on the surface of the inductor core using high-atomization spraying technology; S5, exposing the coil end of the inductor core using laser delamination or micro-polishing technology to form an inner electrode; S6, sequentially depositing a copper layer, a nickel layer, and a tin layer using roll-to-roll continuous electroplating technology to form an outer electrode; S7, cutting the conductive strip, separating qualified inductors, and packaging them.
Need to check novelty before this filing date? Find Prior Art
