Wafer alignment methods and apparatus, charged particle beam apparatus

Abstract

This invention discloses a wafer alignment method and apparatus, and a charged particle beam device. The wafer alignment method is used to align and place a wafer on a wafer carrier disk of a sample stage, with an annular electrode arranged around the wafer carrier disk. The method includes: detecting the actual position of the wafer before it reaches above the wafer carrier disk, or when the wafer is above the wafer carrier disk; obtaining a planned position corresponding to the actual position; calculating the positional deviation between the actual position and the planned position; adjusting the wafer's transport path and / or moving the position of the sample stage according to the positional deviation, so that when the relative displacement between the wafer and the sample stage in the horizontal direction stops changing, the theoretical deviation between the center of the wafer and the center of the annular electrode is within a preset range; and moving the wafer downwards to place it on the wafer carrier disk.

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