RF connection components and semiconductor processing equipment
TW202642570APending Publication Date: 2026-10-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information
- Application Number
- TW114141516
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-10-27
- Publication Date
- 2026-10-16
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Abstract
This invention discloses a radio frequency (RF) connection assembly and a semiconductor processing apparatus. The RF connection assembly includes an RF guide rod, one end of which is provided with an elastic snap-fit element, and the other end is electrically connected to an RF power supply. A conductive rod within a base handle is inserted into the elastic snap-fit element and connected to the RF guide rod, allowing the RF power supply to feed RF energy through the RF guide rod to the conductive rod and the electrostatic chuck connected to the conductive rod. This invention ensures the stability of the connection between the RF guide rod and the conductive rod, enabling stable transmission of RF energy to the electrostatic chuck, thereby ensuring wafer fabrication efficiency and yield.
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