Power module and heat dissipation system

TW202642764APending Publication Date: 2026-10-16DELTA ELECTRONICS INC(CN)
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Patent Information

Application Number
TW115111555
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-10
Filing Date
2026-03-25
Publication Date
2026-10-16

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    Figure TWG2TA001081286_003
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Abstract

A power module and a heat dissipation system are provided. The power module includes a bottom plate, a power unit and a heat dissipation assembly. The power unit is disposed on the bottom plate and includes a middle plate and power components. The middle plate has a first surface and a second surface opposite to each other along a first axis. The power components are disposed on the first surface and / or the second surface of the middle plate. The heat dissipation assembly includes a heat dissipation plate disposed corresponding to the first surface or the second surface of the middle plate of the power unit. When the heat dissipation plate is disposed corresponding to the first surface of the middle plate, the heat dissipation plate is configured to be in thermal contact with the first surface, and projections of the heat dissipation plate and the first surface on the first axis are at least partially overlapped. When the heat dissipation plate is disposed corresponding to the second surface of the middle plate, the heat dissipation plate is configured to be in thermal contact with the second surface, and projections of the heat dissipation plate and the second surface on the first axis are at least partially overlapped.
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