Circuit board resin and method for manufacturing the same

Abstract

A circuit board resin and the method for manufacturing the same include a complex layer resin, an insulating layer, first and second photosensitive resins, a metal paste, and a first channel. The complex layer includes a first outer complex layer, a first inner complex layer, and a laminate resin. The insulating layer is disposed between the first outer complex layer and the first inner complex layer, in the laminate resin, and between the second outer complex layer and the laminate resin. The first photosensitive resin is disposed between the first inner complex layer and the laminate resin. The second photosensitive resin is disposed between the first outer complex layer and the first inner complex layer. The metal paste is disposed in the first and second photosensitive resins. The first channel is disposed between the first outer complex layer and the laminate resin.

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