Electromagnetic wave shielding material
TW202642787APending Publication Date: 2026-10-16DAICEL CORP +1
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Patent Information
- Application Number
- TW115107443
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-03
- Filing Date
- 2026-03-02
- Publication Date
- 2026-10-16
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Abstract
The electromagnetic wave shielding material of the present invention is formed by a plurality of layers, wherein the plurality of layers, from the side closest to the electromagnetic wave source, sequentially comprises: an incident layer: with a thickness of 1 to 200 μm, formed of a material having a real part of dielectric constant of 5 to 100 and a dielectric loss tangent of 0.2 to 2; a spacer layer: with a thickness of 10 to 500 μm, formed of a material having a real part of dielectric constant of 1 to 10 and a dielectric loss tangent of 0 to 0.2; and a shielding layer: with a thickness of 1 to 100 μm, formed of a material having a real part of dielectric constant of 50 or more and a dielectric loss tangent of 1 or more. none
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