Installation device and installation method

Abstract

A mounting apparatus and method are provided for clamping a support substrate placed on a stage using a preferred clamp. According to one embodiment, the mounting apparatus for mounting electronic components onto a support substrate includes: a component supply unit for supplying the electronic components; a stage unit having a stage for placing the support substrate and clamps for clamping the support substrate placed on the stage; a transfer unit for transferring the electronic components supplied by the component supply unit; a mounting unit for mounting the electronic components transferred by the transfer unit onto the support substrate placed on the stage; and a control unit for controlling the operation of the mounting apparatus, wherein the control unit makes the moving speed of the clamps when clamping the support substrate different from the moving speed of the clamps when releasing the clamps from the support substrate.

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