Installation device and installation method
TW202642790APending Publication Date: 2026-10-16SHIBAURA MECHATRONICS CORP
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Patent Information
- Application Number
- TW115112395
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2026-03-30
- Publication Date
- 2026-10-16
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Abstract
A mounting apparatus and mounting method are provided for clamping a support substrate placed on a stage using a preferred clamp. According to one embodiment, the mounting apparatus for mounting electronic components onto a support substrate includes: a component supply unit for supplying the electronic components; a stage unit having a stage for placing the support substrate, a first clamp for clamping the support substrate placed on the stage, and a second clamp for clamping the support substrate placed on the stage; a transfer unit for transferring the electronic components supplied by the component supply unit; a mounting unit for mounting the electronic components transferred by the transfer unit onto the support substrate placed on the stage; and a control unit for controlling the operation of the mounting apparatus. The first clamp includes a surrounding portion that surrounds the outer periphery of a support member in plan view, and has an opening provided within the surrounding portion in plan view.
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