Semiconductor structure and methods of fabrication thereof
TW202642822APending Publication Date: 2026-10-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114120226
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-04
- Filing Date
- 2025-05-29
- Publication Date
- 2026-10-16
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Abstract
A semiconductor device structure is provided. The semiconductor device structure comprises a first stack of channels of a p-type field effect transistor (PFET) and a second stack of channels of an n-type field effect transistors (NFET) adjacent to the PFET. A gate dielectric layer is formed on each channel of the PFET and the NFET. A first metal gate layer is formed on the gate dielectric layer of the PFET. A second metal gate layer is formed on the gate dielectric layer of the NFET. The second metal gate layer comprises one or more types of aluminum compounds filling at least a central portion of a channel-to-channel space between each pair of immediately adjacent channels of the NFET.
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