Semiconductor structure, method of manufacturing semiconductor device, and noise-generator structure

TW202642835APending Publication Date: 2026-10-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114121121
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-09
Filing Date
2025-06-05
Publication Date
2026-10-16

Smart Images

  • Figure TWG2TA001080451_001
    Figure TWG2TA001080451_001
  • Figure TWG2TA001080451_002
    Figure TWG2TA001080451_002
  • Figure TWG2TA001080451_003
    Figure TWG2TA001080451_003
Patent Text Reader

Abstract

A method, includes: forming a semiconductor structure including a plurality of nanostructures, a sacrificial gate structure, a source feature, and a drain feature; implanting ions in top and bottom surfaces of the plurality of nanostructures in channel regions of nanostructures; removing the sacrificial gate structure wherein a thickness of a nanostructure becomes uneven; and forming a replacement gate structure around the nanostructures, wherein a combination of an interfacial layer (IL) of the replacement gate structure surrounding the nanostructure and a high K dielectric layer of the replacement gate structure surrounding the nanostructure has an uneven thickness.
Need to check novelty before this filing date? Find Prior Art