Semiconductor device with storage node contacts

TW202642838APending Publication Date: 2026-10-16SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
TW114148717
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-14
Filing Date
2025-12-11
Publication Date
2026-10-16

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Abstract

A semiconductor device includes: a bit line on a substrate and extending in a first direction parallel to an upper surface of the substrate; a semiconductor pattern on the bit line and extending in a direction perpendicular to the upper surface of the substrate; a gate electrode on a side surface of the semiconductor pattern and extending in a second direction intersecting the first direction; a storage node contact on an upper surface of the semiconductor pattern; an upper insulating layer covering a side surface of the storage node contact; and a capping pattern between the upper insulating layer and the gate electrode. The upper insulating layer is on an upper surface of the capping pattern. The upper surface of the semiconductor pattern and the upper surface the capping pattern each have a concave profile.
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