Semiconductor device and forming method thereof
TW202642846APending Publication Date: 2026-10-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114136021
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-07-24
- Filing Date
- 2025-09-19
- Publication Date
- 2026-10-16
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Abstract
Semiconductor devices and methods of forming the same are provided. In an embodiment, an exemplary method includes receiving a precursor structure comprising an active region disposed over a substrate and extending lengthwise along a first direction, a source / drain feature disposed over the active region, a top portion of the source / drain feature is above a top surface of a channel region of the active region, and a gate structure comprising a gate dielectric layer over the active region and a gate electrode over the gate dielectric layer, the gate electrode comprising a titanium-containing material. The method also includes performing an etching process to partially remove the top portion of the source / drain feature, at least partially converting a remaining part of the top portion of the source / drain feature into a dielectric layer, and after the converting, forming a source / drain contact electrically coupled to the source / drain feature.
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