Semiconductor device
TW202642851APending Publication Date: 2026-10-16SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW114142170
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-08
- Filing Date
- 2025-10-30
- Publication Date
- 2026-10-16
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Abstract
A semiconductor device according to the disclosed concepts includes first active patterns spaced apart from one another in a first direction, a first device isolation layer between the first active patterns adjacent to one another; first channel patterns on the first active patterns, and a cutting pattern extending vertically between the first channel patterns. The cutting pattern comprises a first portion and a second portion on the first portion. A width of the first portion is greater than a width of the second portion at a boundary between the first portion and the second portion.
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