Semiconductor device comprising an intermediate insulating structure
TW202642855APending Publication Date: 2026-10-16SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- TW115108787
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-11
- Filing Date
- 2026-03-10
- Publication Date
- 2026-10-16
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Abstract
A semiconductor device is provided having a lower structure, an upper structure, and an intermediate insulating structure positioned between them. The lower structure contains source / drain regions and active layers with a gate structure disposed above the active layers. The upper structure contains source / drain regions and active layers with a gate structure disposed below the active layers, vertically overlapping the lower gate structure. The intermediate insulating structure includes an insulating structure positioned below the upper structure and a barrier structure on the lower structure. The barrier structure has a barrier insulating layer and a barrier pattern disposed above the barrier insulating layer, the barrier pattern surrounding the insulating structure and contacting lower surfaces of the upper source / drain regions.
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