Semiconductor devices and methods of manufacturing semiconductor devices
TW202642871APending Publication Date: 2026-10-16AMKOR TECH SINGAPORE HLDG PTE LTD
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Patent Information
- Application Number
- TW115124919
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-05-15
- Filing Date
- 2021-04-29
- Publication Date
- 2026-10-16
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Abstract
In one example, a semiconductor device comprises a spacer substrate, a first lens substrate over the first spacer substrate, and a lens protector over the first lens dielectric adjacent to the first lens. The spacer substrate comprises a spacer dielectric, a spacer top terminal, a spacer bottom terminal, and a spacer via. The first lens substrate comprises a first lens dielectric, a first lens, a first lens top terminal, a first lens bottom terminal, and a first lens via. A first interconnect is coupled with the spacer top terminal and the first lens bottom terminal. Other examples and related methods are also disclosed herein.
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