Package structure

TW202642874APending Publication Date: 2026-10-16ENNOSTAR CORP
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Patent Information

Application Number
TW114112529
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-04-01
Publication Date
2026-10-16

Smart Images

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    Figure TWG2TA001079928_001
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    Figure TWG2TA001079928_002
  • Figure TWG2TA001079928_003
    Figure TWG2TA001079928_003
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Abstract

A package structure is provided. The package structure includes a substrate, an integrated circuit, a light-emitting element, a light-receiving element, a first light-blocking part, a second light-blocking part, and a encapsulation body. The integrated circuit is disposed on the substrate. The light-emitting element is disposed on the substrate and has a light-emitting surface. The light-receiving element is disposed on the integrated circuit and has a light-receiving surface. The first light-blocking part is disposed on the integrated circuit and between the light-emitting surface of the light-emitting element and the light-receiving surface of the light-receiving element. The second light-blocking part is disposed on the first light-blocking part. The encapsulation body is disposed on the light-emitting element and the light-receiving element.
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