Semiconductor manufacturing apparatus, calibration method for bonding positions, die bonding method, and method for manufacturing semiconductor devices.

Abstract

The objective of this invention is to provide a technique for correctly bonding chips in a semiconductor manufacturing apparatus. The solution involves a semiconductor manufacturing apparatus comprising: a mounting section that holds a substrate; a bonding head whose front end can selectively mount either a first measuring member or a clamp; a driving section that moves, lifts, or rotates the mounting section or the bonding head; and a control device that determines the bonding position of the chip. The control device is configured to calculate a correction value for the movement distance of the bonding head based on the difference between the head position measured by moving the bonding head on which the first measuring member is mounted and the commanded position given to the driving section.

Images