Method for producing a microelectromechanical system

TW202642909APending Publication Date: 2026-10-16ROBERT BOSCH GMBH
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Patent Information

Application Number
TW115105237
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-13
Filing Date
2026-02-10
Publication Date
2026-10-16

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Abstract

The invention relates to a method for producing a microelectromechanical system. A first bonding layer is applied to a front face of a first carrier wafer. Furthermore, a second wafer is applied to the first bonding layer. In addition, a second bonding layer is applied to a first face of the second wafer opposite the first bonding layer. Furthermore, at least a first cavity and an adjacent second cavity are generated within the second bonding layer and the second wafer in such a way that, from the second wafer, there are generated at least a first cap-like structure
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