Surface modification method and surface modification apparatus

Abstract

The objective of this invention is to suppress the reduction in bonding strength between bonded substrates. As a solution, this invention provides a surface modification method for modifying the bonding surfaces of a substrate bonded to other substrates using plasma from a processing gas. The method includes the following steps: a first adjustment step, a vacuuming step, a second adjustment step, and a modification step. The first adjustment step involves adjusting the moisture content within a processing container by supplying humidified gas at a first flow rate to the container housing the substrate. The vacuuming step involves evacuating the processing container after the first adjustment step. The second adjustment step involves adjusting the moisture content within the processing container by supplying humidified gas at a second flow rate greater than the first flow rate. The modification step involves generating plasma from the processing gas within the processing container after the second adjustment step to modify the bonding surfaces of the substrates.

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