Methods to form gate oxide
TW202642914APending Publication Date: 2026-10-16APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW115109869
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-07
- Filing Date
- 2026-03-17
- Publication Date
- 2026-10-16
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Abstract
Processing methods may be performed to produce semiconductor structures that include a high-k dielectric material. The methods include forming an epitaxial silicon layer on a substrate surface. An interfacial layer is formed on the epitaxial silicon layer by pre-treating the epitaxial silicon layer, oxidizing the pre-treated surface to form the interfacial layer, and performing a post-treatment process. The interfacial layer may then be treated with hydration chemistry to form a treated interfacial layer, followed by deposition of a high-k dielectric layer on the treated interfacial layer.
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