Methods to form gate oxide

TW202642914APending Publication Date: 2026-10-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW115109869
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-07
Filing Date
2026-03-17
Publication Date
2026-10-16

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Abstract

Processing methods may be performed to produce semiconductor structures that include a high-k dielectric material. The methods include forming an epitaxial silicon layer on a substrate surface. An interfacial layer is formed on the epitaxial silicon layer by pre-treating the epitaxial silicon layer, oxidizing the pre-treated surface to form the interfacial layer, and performing a post-treatment process. The interfacial layer may then be treated with hydration chemistry to form a treated interfacial layer, followed by deposition of a high-k dielectric layer on the treated interfacial layer.
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