Electroplating method and integrated circuit device structure

TW202642917APending Publication Date: 2026-10-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW115125508
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-08-25
Filing Date
2022-08-23
Publication Date
2026-10-16

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    Figure TWG2TA001081432_003
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Abstract

Exemplary methods of electroplating a metal with a nanotwin crystal structure are described. The methods may include plating a metal material into at least one opening on a patterned substrate, where at least a portion of the metal material is characterized by a nanotwin crystal structure. The methods may further include polishing an exposed surface of the metal material in the opening to reduce an average surface roughness of the exposed surface to less than or about
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