Plating apparatus, method for estimating the state within the plating apparatus, and computer program

Abstract

This invention provides a plating apparatus capable of accurately inferring the current density on a plating surface even when plating conditions change. The plating apparatus includes: a sensor configured to measure the potential of a plating solution near the outer edge of a substrate held by a substrate holder; and a state inferrer configured to calculate a state inference quantity representing the current density at the outer edge of the substrate, based on an observation model and a state transition model, using the measured potential as input. The state inferrer is configured to perform observation model-based computation using a first trained neural network model, which outputs an inference quantity representing the potential of the plating solution near the outer edge of the substrate if a state variable representing the current density at the outer edge of the substrate is input.

Images