Wafer protection film forming method and wafer grinding apparatus

TW202642931APending Publication Date: 2026-10-16TAKATORI +1
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Patent Information

Application Number
TW114151349
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-27
Filing Date
2025-12-26
Publication Date
2026-10-16

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Abstract

This invention provides a wafer protection film forming method, which can form a protection film on the surface of a wafer before grinding instead of a pre-formed thin-film protection tape that needs to be attached or peeled off. The method involves using a dispenser of a liquid supply mechanism
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