Contact measuring device and wafer thinning apparatus

Abstract

A contact measuring device applied in a wafer thinning apparatus is disclosed. The contact measuring device comprises: a first mounting seat formed with a mounting hole; a first measuring rod mounted in the mounting hole and extending horizontally above a carrier table, wherein a first measuring probe is disposed at a distal end of the first measuring rod, and the first measuring rod is movable up and down in the mounting hole so that the first measuring probe contacts a wafer and moves up and down with variations in the wafer thickness; a protective gas pipe and a protective liquid pipe, wherein the protective gas pipe is formed with a downward-opening gas channel extending along a length thereof, and the protective liquid pipe is formed with a downward-opening liquid channel extending along a length thereof; the gas channel discharges gas downward to form a gas curtain for blocking processing debris from entering the mounting hole, and the liquid channel discharges liquid downward to form a liquid curtain for blocking processing debris that has passed through the gas curtain from entering the mounting hole.

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