Dicing evaluation apparatus and dicing evaluation method

TW202642934APending Publication Date: 2026-10-16TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
TW115110005
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-28
Filing Date
2026-03-17
Publication Date
2026-10-16

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Abstract

A dicing evaluation apparatus includes an acquisition unit configured to acquire, for each dicing line, evaluation parameters for evaluating dicing quality when a wafer is diced into a plurality of chips by a dicing apparatus, and a calculation unit configured to calculate an evaluation value for each of the plurality of chips based on the evaluation parameters for each dicing line.
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