Manufacturing method of electronic device
TW202642936APending Publication Date: 2026-10-16MITSUI CHEM ICT MATERIA INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115110690
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-31
- Filing Date
- 2026-03-20
- Publication Date
- 2026-10-16
Smart Images

Figure TWG2TA001081255_001 
Figure TWG2TA001081255_002 
Figure TWG2TA001081255_003
Abstract
A manufacturing method of an electronic device includes, in the following order: a process of preparing a structure P provided, in this order, with an electronic component, a surface protective film that becomes water-rinsable after at least one treatment selected from light irradiation and heating, and a backgrinding tape; a BG process of backgrinding, in the structure P, a surface of the electronic component that is opposite to a surface on the surface protective film side; a processing process of performing, with respect to the surface protective film, at least one treatment selected from light irradiation and heating; and a protective film removal process of removing the surface protective film.
Need to check novelty before this filing date? Find Prior Art
