Semiconductor structures and methods for manufacturing semiconductor devices

TW202642939AInactive Publication Date: 2026-10-16凌北卿
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Patent Information

Application Number
TW114137775
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-28
Filing Date
2025-09-30
Publication Date
2026-10-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

A semiconductor structure is provided. The semiconductor structure comprises a first substrate, a second substrate, and a debonding layer. The second substrate is disposed on the first substrate. The second substrate comprises semiconductor material and has a thickness in a range from about
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