Wire discharge machining apparatus, wire discharge machining method, and wafer manufacturing method

Abstract

[Problem] In multi-wire electrical discharge machining (EDM), a wire EDM apparatus is obtained that can improve the uniformity of the thickness of the cut sheet compared to conventional methods. [Solution] The wire EDM apparatus comprises: a oscillating platform, having at least one of a first oscillating platform that reciprocates a wire guide roller in the wire travel direction and a second oscillating platform that reciprocates a wire guide roller in the direction of its rotation axis; and an oscillating platform control unit that controls at least one of the oscillating platforms and controls the flexural shape of the wire electrode mounted between the wire guide rollers in a single vibration mode and the positional relationship between the workpiece and the wire travel direction.

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